Scanning electron microscope and a method for imaging a specimen using the same

ABSTRACT

(1) part or all of the number, coordinates and size/shape and imaging sequence of imaging points each for observation, the imaging position change method and imaging conditions can be calculated automatically from CAD data, (2) a combination of input information and output information for imaging recipe creation can be set arbitrarily, and (3) decision is made of imaging or processing at an arbitrary imaging point as to whether to be successful/unsuccessful and in case a failure is determined, a relief process can be conducted in which the imaging point or imaging sequence is changed.

INCORPORATION BY REFERENCE

The present application claims priority from Japanese applicationJP2006-040125 filed on Feb. 17, 2006, the content of which is herebyincorporated by reference into this application.

BACKGROUND OF THE INVENTION

The present invention relates to a scanning electron microscope (SEM)capable of automatically imaging an arbitrary evaluation point on aspecimen and a method therefore and more particularly, to an SEMapparatus having the function to create and determine an imaging recipeautomatically from circuit design data without using an actual wafer anda method therefore, the imaging recipe being necessary for observing anarbitrary evaluation point with high image quality and high accuracy.Registered in the imaging recipe are imaging parameters such ascoordinates of an imaging point, size/shape (of an imaging areaassociated the imaging point but will be simply referred to as imagingpoint size/shape in the following description), imaging sequence ofimaging points each for addressing, auto-focus, auto-stigmatism orauto-brightness contrast, imaging position changing method and imagingconditions and templates of evaluation points or imaging points as well.

For formation of a wiring pattern on a semiconductor wafer, a method isadopted, according to which a coating material called resist is coatedon the semiconductor wafer, a mask for light exposure of the wiringpattern (reticle) is superimposed on the resist and rays of visiblelight or ultraviolet light or an electron beam is irradiated from abovethe reticle to expose the resist to light, thus forming the wiringpattern. The thus obtained wiring pattern changes in its pattern shapewith either the intensity the irradiated visible ray, ultraviolet ray orelectron beam has or the aperture and therefore, for formation of ahighly accurate wiring pattern, maturity of the result of pattern needsto be inspected. For the inspection, a critical dimension scanningelectron microscope (CD-SEM) has hitherto been used widely. A dangerousor critically imperfect point on a semiconductor pattern to be inspectedis observed as an evaluation point (hereinafter referred to as EP) withthe SEM, so that various geometrically dimensional values including thewiring width and the like the pattern has can be measured from anobserved image and the maturity of the result of the pattern can beevaluated on the basis of the thus measured dimensional values.

In order for the EP to be imaged with high picture quality withoutpositional shift, part or all of imaging points including an addressingpoint (AP), an auto-focus point (AF), an auto-stigmatism point (AST) andan auto-brightness/contrast control point (ABCC) are set and atindividual imaging points, addressing, auto-focus adjustment,auto-stigmatism adjustment and auto-brightness/contrast adjustment,respectively, are conducted. As regards the amount of shift of imagingposition in the addressing, matching between an SEM image at a knowncoordinate AP registered as a registry template in advance and an SEMimage observed in actual imaging sequence (actual imaging template) isexamined and an amount of positional shift in the matching is estimatedas an imaging positional shift amount in addressing. The aforementionedEP, AP, AF, AST and ABCC are collectively called imaging points and thecoordinates of points including part or all of the imaging points, thesize/shape of an imaging area associated with an imaging point (simply,the imaging point size/shape), the imaging sequence of imaging pointsand the imaging condition and the registry template as well are managedin the form of an imaging recipe. Conventionally, the imaging recipe hasbeen created manually by an SEM operator, imposing a laborious and timeconsuming job on the operator. Further, for determination of individualimaging points and registration of a registry template in an imagingrecipe, a wafer must be imaged actually at low magnification and hencethe creation of imaging recipe is a factor responsible for a degradedoperating rate of SEM. In addition, as miniaturization of the patternadvances, followed by introduction of, for example, a technique of OPC(optical proximity correction), the number of EP's subject to evaluationincreases extravagantly and the manual creation of the imaging recipe isprone to be impractical.

Under the circumstances, a semiconductor inspection system is disclosedin JP-A-2002-328015 in which an AP is determined on the basis ofsemiconductor circuit design data (hereinafter referred to as CAD(computer aided design) data) described in, for example, GDS2 format anddata at the AP is cut out of the CAD data so as to be registered as theregistry template (hereinafter, the template created by cutting the CADdata will be referred to as a CAD data template) in an imaging recipe.In the system, any actual wafer need not be imaged only for the sake ofdetermination of the AP and registration of the registry template andimprovements in the operating rate of SEM can be realized. Then, when anSEM image at the AP is acquired in actual imaging sequence (called anactual imaging template), the system functions to perform matchingbetween the actual imaging template and the CAD data template,reregister an SEM image corresponding to a position of the CAD datatemplate as an SEM image template in the imaging recipe and thereaftercause the reregistered SEM image template to be used for an addressingprocess. The system further has a function to automatically detect acharacteristic part of pattern from the CAD data and register it as theAP.

SUMMARY OF THE INVENTION

In the prior art, problems as below are encountered in creating animaging recipe used when a plurality of observation points on a specimenare imaged sequentially by using a scanning electron microscope.

Firstly, in order to inspect maturity or perfection of the result of asemiconductor pattern at an EP, an imaging recipe for imaging the EPmust be prepared. As miniaturization of the semiconductor patternadvances, the number of EP's to be inspected increases, raising aproblem that much labor and time are necessary for creation of theimaging recipe. As for automatic selection of AP coordinates, theaforementioned Patent Document gives a description “a characteristicpattern part is automatically detected” but fails to describe aspecified method therefore and besides other information to bedesignated in the imaging recipe and regarding, for example, thenecessity/needlessness of setting individual imaging points (AP, AF,AST, ABCC), the number of imaging points, the coordinates and size/shapeof each imaging point, the imaging condition and the imaging sequence isdesignated pursuant to an existing manual, with the result that theautomation rate of imaging recipe creation is very low and the SEMoperator cannot be indebted to a large reduction of work time.

Further, in the actual imaging sequence, imaging or processing based onthe prepared imaging recipe sometimes fails on account of a phenomenonunexpected during the creation of the imaging recipe (as an example, afailure in addressing attributable to defective formation of an actualpattern at an AP). Accordingly, there need a method of creating animaging recipe which can prevent imaging or processing from failing inthe presence of the aforementioned phenomenon and a relief methodapplicable to the case where imaging or processing fails even when theimaging recipe is created through the aforementioned creation method.

The present invention intends to provide a scanning electron microscopeapparatus having the function to accurately and speedily create animaging recipe whose performance is equivalent to or more excellent thanthat of an imaging recipe created manually on the basis of the uniqueknow-how an SEM operator is stocked with and an imaging method using theapparatus.

According to the present invention, a scanning electron microscopeapparatus has features described below and an imaging method uses theapparatus.

-   (1) In a recipe creation method, an imaging recipe for observation    of an EP is created on the basis of CAD data representing design    information of a pattern on a wafer as viewed in a low magnification    field. Enumerated as imaging parameters are (a1) the number and (a2)    coordinates and (a3) size/shape of imaging points (AP, AF, AST,    ABCC) for observation of the EP, (a4) the imaging sequence    (inclusive of imaging order of the EP and imaging points and    electron beam vertically incident coordinates), (5a) imaging    position changing method (stage shift, beam shift), (6a) imaging    conditions (probe current, accelerating voltage, scan direction of    electron beam and so on), and (a7) evaluation value or preferential    order of the imaging sequence or the template. Then, output    information includes part or all of the imaging parameters and the    aforementioned imaging parameters and a template such as an AP    template are registered in the imaging recipe.-   (2) Available as input information are (b1) evaluation point    information such as the coordinates of the EP, the size/shape and    the imaging condition at the EP, (b2) design pattern information    such as CAD data in the vicinity of the EP (inclusive of layer    information), pattern extraction residual information of mask data,    pattern line width information, the kind of wafer to be imaged, the    process and material information for pattern and underlayer, (b3)    processing parameters of the imaging recipe automatic creation    engine such as search ranges of the imaging points (AP, AF, AST,    ABCC), necessary condition for a selective factor index value the    imaging point must satisfy (given by, for example, a threshold value    of the index value), selective factor index preferential order    (given by, for example, weighting among index values), a forbidden    area prohibited from being selected as the imaging point, the    estimative amount of discrepancy in shape between design pattern and    actual pattern and apparatus conditions (stage shift range, stage    shift/beam shift presumptive error), (b4) user's request    specifications such as requested positioning accuracy of an imaging    position for each imaging point, requested picture quality (requests    for focus adjustment, stigmatism adjustment, brightness/contrast    adjustment and contamination and a request for permissible electron    beam incident angle at the EP as well) and requested imaging time    and (b5) history information (such as information concerning    succeeded (failed) imaging point in the past). Then, the input    information includes any of the above pieces of information. In    addition to the above pieces of information (b1) to (b5), the input    information may include values or default values or settable ranges    thereof of the output information (imaging parameters) (a1) to (a7)    described in (1) above. Namely, a combination of arbitrary    parameters from the above sets of (a1) to (a7) and (b1) to (b5) is    set as the input information and a combination of arbitrary    parameters of the above (a1) to (a7) is set as the output    information.-   (3) It is characteristic of the EP imaging sequence that making a    decision as to whether imaging or processing at an arbitrary imaging    point is successful or unsuccessful is accompanied. If the imaging    or processing is determined to be unsuccessful in the    success/failure decision, a relief process is taken which changes    the imaging point or imaging sequence to make the imaging or    processing successful.-   (4) The templates at an evaluation point and at various imaging    points determined in the recipe creation are registered in an    imaging recipe. To this end, CAD data at the evaluation point or    imaging points (CAD data template), modified CAD data resulting from    a shape modification applied to the CAD data (modified CAD data    template), a CAD image obtained by applying image quantization to    the CAD data (CAD image template), a modified CAD image obtained by    applying an arbitrary image process to the CAD image (modified CAD    image template), an SEM image actually picked up at the evaluation    point or imaging points (SEM image template) and a modified SEM    image obtained by applying an arbitrary process to the SEM image    (modified SEM image template inclusive of data converted to line    segment data through line segment extraction) are selectively or    totally registered in the imaging recipe in accordance with a    matching scheme between an actual imaging template used for    addressing an imaging position in the actual imaging sequence and a    registry template.

According to the present invention, any operator having no specialknowledge of the SEM can immediately be allowed to create a highlyaccurate imaging recipe without resort to a wafer and without dependingon the difference in skill individual operators have, thereby attainingthe following advantages.

-   (1) An imaging recipe can be created automatically at a high rate.    The combination of input/output parameters can be set arbitrarily    and desired output information can be obtained on the basis of a    value or default value of a parameter which can be given as input    information or a settable range thereof.-   (2) Even in the event that imaging or processing based on the    created imaging recipe fails on account of a phenomenon or    inconvenience unexpected in the course of imaging recipe creation, a    relief process can be taken which changes the imaging template or    imaging sequence to make the imaging or processing successful.-   (3) In calculation of a selective factor index, CAD data or a CAD    image can be utilized selectively in accordance with the selective    factor index to create a highly accurate imaging recipe within a    short period of time.-   (4) By calculating dense distribution information of line widths    (line width map) from the CAD data, a proper image quantized width    of less pattern shape collapse can be determined automatically.    Further, by using a proper CAD image created with the image    quantized width as input information in the calculation of an    arbitrary selective factor index value, a good calculation accuracy    of the selective factor index value can be obtained.-   (5) For registration of the registry template, the aforementioned    CAD data template, modified CAD data template, CAD image template or    modified CAD image template is selectively or totally registered in    the imaging recipe in accordance with the matching scheme between    the actual image template plate and the registry template, so that    speedup of the matching process and the high accuracy of matching    can be achieved.

These and other objects, features and advantages of the invention willbe apparent from the following more particular description of preferredembodiments of the invention, as illustrated in the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic block diagram showing the construction of an SEMapparatus.

FIG. 2A is a diagram for explaining irradiation of an electron beam on asemiconductor wafer.

FIG. 2B is a diagram showing states of individual pixels of an image inwhich electrons given off from the semiconductor wafer under irradiationof the electron beam are detected.

FIG. 3A is a flowchart showing the imaging sequence.

FIG. 3B is a diagram showing an example of template positions on a lowmagnification image.

FIG. 4 is a flowchart showing the overall process.

FIG. 5 is a diagram of a list of input/output information.

FIG. 6A is a block diagram showing an example of a combination ofgenerally described input/output information.

FIG. 6B is a block diagram showing another example of a combination ofgenerally described input/output information.

FIG. 7A is a diagram showing the imaging sequence for imaging anarbitrary p-th evaluation point EP.

FIG. 7B is a diagram showing the imaging sequence when two AP's are set.

FIG. 7C is a diagram showing the imaging sequence when the shape of AParea other than square is set.

FIG. 7D is a diagram showing the imaging sequence when an imaging pointis shared by a plurality of different EP's.

FIG. 7E is a diagram showing an example where an imaging point is sharedby a plurality of EP's and correspondingly, the order of imaging theplural EP's is optimized.

FIG. 7F is a diagram showing the relief function in the event of afailure in imaging.

FIG. 7G is a diagram also showing the relief function in the event of afailure in imaging.

FIG. 8 is a flowchart showing the imaging sequence.

FIG. 9 is a diagram showing the contents of a process executed by animaging recipe automatic creation engine.

FIG. 10 is a diagram showing positions of candidates for imaging pointsand exaggeratedly illustrating an example of the imaging point candidateposition to show a pattern range to be evaluated.

FIG. 11 is a diagram showing a GUI screen.

FIG. 12A is a diagram showing procedures of creating modified CAD data,a CAD image and a modified CAD image from CAD data.

FIG. 12B is a diagram showing the state obtained by decomposing the CADdata interconnecting apexes by dotted lines to image quantized widthsand imaging them.

FIG. 13A is a CAD diagram showing an exemplified setting of a forbiddenarea in consideration of a beam shift movable range.

FIG. 13B is a CAD diagram showing an exemplified setting of forbiddenareas for suppression of deposition of contamination in consideration ofplural EP's.

FIG. 14A is a diagram showing an AP shared by a plurality of differentEP's.

FIG. 14B is a diagram showing incident angles of an electron beam whenplural EP's and an AP which are at coordinates different from electronbeam vertically incident coordinates are imaged.

FIG. 14C is a diagram showing electron beam vertical incidentcoordinates and incident angles of an electron beam when imaging EP, AP.

FIG. 15A is a diagram for explaining a method of registering templatesof a selected imaging point in the imaging recipe.

FIG. 15B is a diagram showing a variation of a process for matchingbetween a registry template and an actual image template.

FIG. 16A is a diagram showing an example of construction of an apparatussystem.

FIG. 16B is a diagram showing another example of construction of theapparatus system.

DESCRIPTION OF THE EMBODIMENTS

Embodiments of the present invention will now be described withreference to FIGS. 1 to 16B.

1. SEM

1.1 SEM Constituent Components

Referring first to FIG. 1, there is illustrated in block diagram formcomponents constituting a scanning electron microscope (SEM) foracquiring a secondary electron image (SE image) or a backscatteredelectron image (BSE image) of a specimen in the embodiments of theinvention. The SE image and the BSE image are generally termed an SEMimage. An image acquired herein includes part or all of a top-down imageof a measuring object observed in the vertical direction or of a tiltimage of the object observed from a direction of arbitrary tilt angle.

An electron gun 103 emits an electron beam 104. The landing position ofthe electron beam and the aperture are controlled by means of adeflector 106 and an objective lens 108 such that the electron beam isfocused and irradiated on an arbitrary position on a semiconductor wafer101 representing a specimen mounted on a stage 117. Secondary electronsand backscattered electrons are given off from the semiconductor wafer101 irradiated with the electron beam and secondary electrons whosetrajectory is separated from that of the illuminating electron beam bymeans of an ExB deflector 107 are detected with a secondary electrondetector 109. On the other hand, the backscattered electrons aredetected with backscattered electron detectors 110 and 111. Thebackscattered electron detectors 110 and 111 are disposed in oppositedirections. The secondary electrons detected by the secondary electrondetector 109 and the backscattered electrons detected by thebackscattered electron detectors 110 and 111 are converted into digitalsignals by means of A/D converters 112, 113 and 114 and are then storedin an image memory 122 so that they may be applied with image processingby means of a CPU 121 in accordance with purposes.

A method of producing an image from a signal amount of electrons givenoff from the semiconductor wafer 207 when the electron beam is scannedand irradiated on the semiconductor wafer will be described withreference to FIGS. 2A and 2B. For example, the electron beam is scannedand landed in x direction as indicated at 201 to 203 and in y directionas indicated at 204 to 206 in FIG. 2A. By changing the deflectiondirection of the electron beam, the scan direction can be changed.Locations on the semiconductor wafer indicated by G1 to G3 areirradiated with the electron beams 201 to 203 scanned in the xdirection, respectively. Similarly, locations on the semiconductor waferindicated by G4 to G6 are irradiated with the electron beams 204 to 206scanned in the y direction, respectively. Amounts of electron signalsemanating from the wafer at the G1 to G6 are indicative of values ofintensities of illumination at pixels H1 to H6, respectively, in animage 209 shown in FIG. 2B (right below suffixes to G correspond tothose to H, respectively). In FIG. 2B, a coordinate system for definingx and y directions on the image is designated by 208.

Designated at 115 in FIG. 1 is a computer system which performsprocessing/control, such as transmission of control signals to a stagecontroller 119 and a deflection controller 120 or application of variouskinds of image processing to an image picked up at an arbitrary imagingpoint on the semiconductor wafer 101, in order to photograph the imagingpoint on the basis of an imaging recipe. The imaging point referred toherein includes part or all of points each for addressing, auto-focus,auto-stigmatism or auto-brightness/contrast and an evaluation point. Theprocessor/controller 115 is connected to a display 116 and provided witha GUI (graphic user interface) for displaying images to the user. The XYstage 117 is adapted to move the semiconductor wafer 101 to enable animage at an arbitrary position on the semiconductor wafer to be imaged.Changing the observation position by means of the XY stage 117 is calledstage shift and changing the observation position by deflecting theelectron beam with the deflector 106 is called beam shift. Speaking ofgeneral properties, the stage shift provides a wide movable range buthas a low accuracy of positioning the imaging position and contrarily,the beam shift provides a narrow movable range but has a high accuracyof positioning the imaging position.

In FIG. 1, the embodiment is described as having the two backscatteredelectron detectors but the number of the backscattered electrondetectors can be decreased or increased.

The computer system 115 functions to create an imaging recipe through amethod to be described later and perform imaging by controlling the SEMapparatus on the basis of the imaging recipe but part or all of theprocessing/control as above can be assigned to a plurality of processingterminals and executed thereby, as will be detailed later with referenceto FIGS. 16A and 16B.

Available as methods of acquiring a tilt image by observing a measuringobject from a direction making an arbitrary tilt angle are (1) a methodin which a tilt image is picked up by deflecting an electron beamilluminating through an electron optics so as to tilt the irradiation orlanding angle of the electron beam (for example, JP-A-2000-348658), (2)a method in which the stage 117 itself for moving the semiconductorwafer is tilted (in FIG. 1, the stage is tilted through a tilt angle118) and (3) a method in which the electron optics per se is tiltedmechanically.

1.2 SEM Imaging Sequence

Turning to FIG. 3A, typical imaging sequence for observing an arbitraryevaluation point (EP) will be described. In the imaging sequence, animaging point, an imaging order and an imaging condition are designatedby an imaging recipe.

Firstly, in step 301 in FIG. 3A, a semiconductor wafer representing aspecimen is mounted to the stage 117 of SEM apparatus. In step 302, byobserving a global alignment mark on the wafer with an opticalmicroscope, for example, the wafer is corrected for its origin shift andits rotation.

In step 303, the stage 117 is moved on the basis of control andprocessing by the processor/controller 115 in order that an imagingposition is moved to an addressing point(AP), followed by imaging,parameters for addressing are determined and addressing is carried outon the basis of the determined parameters. To give an additionalexplanation of the AP, it will be appreciated that if, in the course ofobservation of an EP, the EP is managed for direct observation by way ofstage shift, there is a danger of a large shift of the imaging pointattributable to the positioning accuracy of the stage.

Therefore, an AP is observed to which coordinate values of an imagingpoint and its template (a pattern of the imaging point) are oncedesignated in advance for positioning. The template is registered in theimaging recipe and will therefore be called a registry templatehereinafter. The AP is selected from the vicinity of the EP (within amovable range based on the beam shift at the most). As compared to theEP, the AP is generally observed in a lower magnification field of viewand therefore, even in the presence of a slight shift of imagingposition, a dangerous deficiency that the pattern to be imaged as awhole is outside the field of view can be mitigated. Then, by performingmatching between the registry template of AP registered in advance andan actually photographed SEM image of the AP (actual image template), anamount of positional shift of the imaging point at the AP can beestimated. Since coordinate values of the AP and EP are known, arelative displacement amount between the AP and the EP can be determinedand besides, the positional shift amount of the imaging point at the APcan be estimated through the aforementioned matching, thereby ensuringthat the relative displacement amount by which an actual movement is tobe done from the AP imaging position to the EP can be known bysubtracting the positional shift amount from the relative displacementamount. Accordingly, by making a movement by the relative displacementamount through the beam shift of high positioning accuracy, the EP canbe imaged with high coordinate accuracies.

Accordingly, the AP to be registered preferably satisfies conditions (1)the registry AP is a pattern existing at a distance from the EPreachable through beam shift movement (and besides, the range (field ofview: FOV) at the time of imaging the AP is sometimes so conditioned asnot to contain the FOV at the time of imaging the EP to suppressgeneration of contamination at the EP, (2) the imaging magnification forthe AP is lower than that for the EP in consideration of the positioningaccuracy of the stage and (3) the registry AP is characteristic of apattern shape or a brightness pattern and is easy to assure matchingbetween the registry temple and the actually imaged temple.Conventionally, the SEM operator manually makes a decision as to whichlocation is to be selected as the AP but advantageously, in the presentinvention, the aforementioned conditions are evaluated inside the systemto automatically select a good or convenient AP and determine theimaging sequence.

The registry template at the AP can be a CAD image or an SEM image butin a conceivable variation, to avoid the imaging operation from beingdone only for the purpose of registering the imaging template asdisclosed in JP-A-2002-328015, the imaging template at the AP may oncebe registered in the form of a CAD data template and an SEM image of theAP obtained by actual imaging may be reregistered as an SEM imagetemplate.

A complementary description will be given of the aforementioned APselection range or FOV. Generally, the electron beam vertically incidentcoordinates are set at the center coordinates of the EP and so, theselectable range of the AP coincides at the most with the beam shiftmovable range centered on the EP. But when the electron beam verticallyincident coordinates differ from the center coordinates of the EP, aselectable range coincides with a beam shift movable range from theelectron beam vertically incident coordinates. Depending on apermissible electron beam incident angle required of the imaging point,the search range from the electron beam vertically incident coordinatessometimes becomes smaller than the beam shift movable range. This holdstrue for other templates. In the following description, unlessparticularly noticed, the electron beam vertically incident coordinateswill be described as being identical with the center coordinates of theEP in the case of imaging a single EP but as mentioned previously, thepresent invention is not limited thereto. Details of the electron beamvertically incident coordinates will be described later with referenceto FIGS. 14A to 14C.

Next, in step 304, the imaging position is moved to an auto-focus point(AF) through beam shift on the basis of control/processing by theprocessor/controller 115, followed by execution of imaging, parametersfor auto-focus adjustment are determined and an auto-focus adjustment ismade on the basis of the settled parameters. The AF will be describedadditionally herein. With the aim of acquiring a clear image, anauto-focus is made during imaging but when the electron beam isirradiated on the specimen for a long time, contaminative substances aredeposited on the specimen (contamination). Therefore, to restraindeposition of contamination at the EP, coordinates of the vicinity ofthe EP are once observed as the AF to obtain parameters of auto-focusand the EP is then observed on the basis of the thus obtainedparameters.

For the reasons as above, the AF to be registered preferably satisfiesconditions (1) the registry AF has a pattern existing at a distance fromthe AP and EP reachable through beam shift movement and besides an FOVduring AF imaging does not include an FOV during EP imaging, (2) theimaging magnification for the AF is comparable to that for the EP (but,this holds true when the AF is for the EP. In the case of the AF for theAP, the AF is imaged at the imaging magnification comparable to that forthe AP. This stands for AST and ABCC to be described later.) and (3) theregistry AF has a pattern shape easy to undergo auto-focus (prone tofacilitate detection of an image blur due to a defocus). According tothe present invention, like the AP, the aforementioned conditions areevaluated for the sake of AF selection inside the system, permittingexcellent automatic AF selection.

Next, in step 305, the imaging position is moved to an auto-stigmatismpoint (AST) through beam shift on the basis of control/processing by theprocessor/controller 115, followed by execution of imaging, parametersfor auto-stigmatism adjustment are determined and an auto-stigmatismadjustment is made on the basis of the determined parameters. The ASTwill be described additionally herein. With the aim of acquiring animage devoid of distortion, a correction for astigmatic aberration ismade during imaging but when the electron beam is irradiated on thespecimen for a long time, as in the case of the AF, contaminativesubstances are deposited on the specimen (contamination). Therefore, torestrain deposition of contamination at the EP, coordinates of thevicinity of the EP are once observed as the AST to obtain parameters ofauto-astigmatism correction and the EP is then observed on the basis ofthe parameters.

For the reasons as above, the AST to be registered preferably satisfiesconditions (1) the registry AST has a pattern existing at a distancefrom the AP and EP reachable through beam shift movement and besides anFOV during AST imaging does not include an FOV during EP imaging, (2)the imaging magnification for the AST is comparable to that for the EPand (3) the registry AST has a pattern shape easy to undergo theastigmatism correction (prone to facilitate detection of an image blurdue to an astigmatic aberration).

According to the present embodiment, like the AP, the aforementionedconditions are evaluated for the sake of AST selection inside thesystem, permitting excellent automatic AST selection.

Subsequently, in step 306, the imaging position is moved to anauto-brightness/contrast point (ABCC) through beam shift on the basis ofcontrol/processing by the processor/controller 115, imaging is executed,parameters for auto-brightness/contrast adjustment are determined and anauto-brightness/contrast adjustment is made on the basis of thedetermined parameters. The ABCC will be described additionally herein.With the aim of acquiring a clear image having proper brightness valueand contrast, a parameter such as voltage of a photomultiplier in thesecondary electron detector 109, for example, is adjusted so thatsetting can be made to make, for example, the highest part and thelowest part of an image signal fully contrasted or so but as in the caseof the AF, when the electron beam is irradiated on the specimen for along time, contaminative substances are deposited on the specimen.Therefore, to restrain deposition of contamination at the EP,coordinates of the vicinity of the EP are once observed as the ABCC toobtain parameters for brightness/contrast control and the EP is thenobserved on the basis of the parameters.

For the reasons as above, the ABCC to be registered preferably satisfiesconditions (1) the registry ABCC has a pattern existing at a distancefrom the AP and EP reachable through beam shift movement and besides anFOV during ABCC imaging does not include an FOV during EP imaging, (2)the imaging magnification for the ABCC is comparable to that for the EPand (3) the ABCC has a pattern similar to that at the critical dimensionpoint in order that the brightness/contrast of an image picked up at thecritical dimension point by using the parameters adjusted at the ABCCcan be excellent. According to the present invention, like the AP, theaforementioned conditions are evaluated for the sake of ABCC selectioninside the system, permitting excellent automatic ABCC selection.

In an alternative, imaging the AP, AF, AST and ABCC in the steps 303,304, 305 and 306, respectively, may sometime be omitted partly ortotally, the order of 303, 304, 305 and 306 may be exchanged arbitrarilyor the coordinates of the respective AP, AF, AST and ABCC may partlyoverlap (for example, the auto-focus and auto-stigmatism may be carriedout at the same coordinates).

Finally, in step 307, the imaging point is moved to the EP through beamshift, followed by imaging, and under set critical dimension conditions,for example, critical dimension of the pattern is measured. Even at theEP, matching is sometimes performed between the picked-up SEM image andthe registry template corresponding to the EP position and registered inadvance in the imaging recipe and a measured positional shift isdetected. The imaging recipe is written with coordinates of theaforementioned imaging points (EP, AP, AF, AST, ABCC), the imagingsequence and information such as imaging conditions and the SEM observesthe EP on the basis of the imaging recipe. Examples of templatepositions of EP309, AP310, AF311, AST312 and ABCC313 on a lowmagnification image 308 are illustrated at dotted line blocks in FIG.3B.

The present embodiment concerns the method for automatic creation of theimaging recipe. By automating the imaging recipe creation conventionallycarried out manually, time required for recipe creation can be shortenedto promote the total throughput inclusive of preparation for imaging theSEM exhibits. Since, in creating the imaging recipe, the imaging recipecreation is based on design layout information of a semiconductorpattern managed as CAD (computer aided design) data (CAD data) insteadof a low magnification image of an actual wafer, creation work can beexecuted in an off-line fashion, leading to improvements in operatingrate of the SEM.

2. Imaging Recipe Automatic Creation Function

2.1 Input/Output Information

The imaging recipe has been described with reference to FIGS. 3A and 3Bby way of a set of EP, AP, AF, AST and ABCC exemplifying information tobe registered in the imaging recipe. Input/output information used inthe recipe automatic creation method and apparatus according to theinvention is listed in FIG. 5. In the figure, pieces of information 502to 519 positioned at ends of arrows (see an explanatory note on arrow at537) extending to an imaging recipe automatic creation engine 501indicate pieces of input information to the engine 501. Pieces ofinformation 521 to 536 positioned at ends of links (see an explanatorynote on link at 538) connecting to the engine 501 by way of black dotscan be either input information or output information to or from theengine 501.

In other words, the engine 501 features that it can calculate anarbitrary information combination out of pieces of information 502 to519 and pieces of information 521 to 536 as input information and anarbitrary information combination out of pieces of information 521 to536 as output information and can deliver the input information andoutput information. Further, the engine can exclude as unwantedinformation an arbitrary information combination out of pieces ofinformation 502 to 519 and an arbitrary information combination out ofpieces of information 521 to 536 from any of the input information andoutput information. In connection with a method of selecting anarbitrary combination from piece of information 502 to 519 and pieces ofinformation 521 to 536 and providing the selected combination as inputinformation and a method of causing the engine 501 to calculate outputinformation, there are two variations to be described below and thevariations can be used selectively for the input information and outputinformation.

-   (1) As regards arbitrary information selected as input information,    the user designates a fixed value of the input information or sets a    default value prepared in advance in the database 536, for example,    as the input information. On the presupposition of the fixed value    or the default value, the engine 501 calculates an arbitrary output    value. The output information is allowed to contain the input    information. In this case, the engine 501 recalculates an    appropriate value of the input information on the basis of the    inputted input information and delivers the recalculated value.-   (2) As regards arbitrary information selected as input information,    the user sets a range of values the input information can take or    sets a default value in a range of values the input information can    take prepared in advance in the database 536. On the presumption    that the input information can change within the range, the engine    501 calculates arbitrary output information. The output information    can include the input information. In this case, within a range of    values the inputted input information can take, the engine 501    calculates an appropriate value of the input information and    delivers it.

Next, details of the input information pieces 502 to 519 and theinput/output information pieces 521 to 536 the engine 501receives/delivers will be described.

2.1.1 Input Information

Available as information 502 of evaluation point are coordinates 503 ofevaluation point EP [p], size/shape 504 (of an imaging area) and imagingconditions 505 (probe current, accelerating voltage, scan direction ofelectron beam and so on), where arrange number p indicates ID's of aplurality of evaluation points set on a chip located on the wafer (p=1to Np, Np≧1). Generally, the evaluation point is in the form of a squarearea or rectangular area but other arbitrary shapes can be set as animaging area.

Enumerated as the design pattern information 506 are CAD (computer aideddesign) data 507 in the vicinity of an EP, pattern extraction residueinformation 508 of mask data, line width information 509 of pattern (orminimum line width information) and information 510 concerning the kindof a wafer to be imaged, the process and the material of pattern orunderlayer. The CAD data is design information of semiconductor patterndescribed in, for example, GDS2 format and is formulated by, forexample, an arrangement of apex coordinates (x, y) of a contour of thedesign pattern. The CAD data also includes layer information, so thatdata can be processed layer by layer or a plurality of arbitrary layerscan be processed in a superimposed fashion.

The extraction residue information 508 is information indicative of anarea at which the resist film is removed after exposure/development or aleft-behind area (that is, an area serving as an underlayer or an areawhere a gate wiring pattern is formed). Alternatively, however, theextraction residue information 508 and pattern width information 509 canbe calculated as necessary from the CAD data 507 inside the imagingrecipe automatic creation engine 501. Broadly or universally, CAD datacan include, as design information, the CAD data 507, the extractionresidue information 508, the pattern line width information 509 and thekind/process/material information 510. Using the information 508 to 510as input information or calculating these pieces of information in theimaging recipe automatic creation engine 501 is efficient in points asbelow.

More particularly, various kinds of actual imaging templates picked upin the actual imaging sequence are SEM images but in the imaging recipeautomatic creation engine 501, imaging points suitable for the templatesare selected on the basis of the CAD data. Therefore, with a view tofilling the discrepancy between the actual SEM image and the CAD data, aCAD image more resembling an actual SEM image is created by taking theextraction residue information 508 and kind/process/material information510 into account, thereby ensuring that the accuracy of a selectionprocess can be promoted in, for example, evaluation of peculiarity ofimaging point to be described later.

Further, with the line width information 509 and thekind/process/material information 510 used, proneness of a pattern todeformation attributable to the line width, kind, process and material(for example, proneness to deformation caused by fluctuation inlight-exposure parameter) can be considered additionally as a selectivefactor index value and such a process as selecting an imaging pointinclusive of a pattern as hardly deformable as possible can bepermitted. Furthermore, as will be described later, the line widthinformation 509 can be used as input information necessary forcalculation of a selective factor index value inside the imaging recipeautomatic creation engine 501 and when creating a CAD image, isefficient for determination of an image quantizing width (nm/pixel)necessary for creation of the CAD image from a CAD data.

Enumerated as the processing parameter 511 are selective processparameter 512, shape discrepancy estimative amount 513 between a designpattern and an actual pattern and SEM apparatus condition 514. Theselection process parameter 512 defines part or all of parameters of asearch range of an arbitrary imaging point (for example, a range withinwhich movement from the EP is possible through the beam shift), anecessary condition of selective factor index value to be describedlater (threshold value), a selective factor index preferential order(weight) and a forbidden area in imaging point selection (for example,with the aim of suppressing contamination, selection of an imaging pointfrom an EP area and the vicinity x (pixel) of the EP area isprohibited.) The shape discrepancy estimative amount 513 between adesign pattern and an actual pattern defines an amount of deformation anactual pattern shape exhibits in relation to a design pattern shape onaccount of optical proximity effect (OPE) and fluctuation of thelight-exposure condition. For example, in the case of a line pattern,the shape discrepancy estimative amount 513 corresponds to an amount ofshrinkage and an amount of rounding at the line end. By reflecting theshape discrepancy estimative amount 513 on the evaluation of a patternshape associated with an imaging point based on the design data, failurein pattern shape evaluation and imaging point selection concomitant withthe deformation amount can be avoided. The SEM apparatus condition 514defines parameters indicative of characteristics of the SEM apparatusrepresented by the movable range through beam shift and the stageshift/beam shift estimative positioning error. With the beam shiftmovable range inputted as input information, it can be decided whethermovement between arbitrary imaging points through beam shift ispossible, offering efficiency in determination of the imaging sequenceand imaging position change method (stage shift or beam shift).

Also, with the stage shift/beam shift estimative error used as inputinformation, a shift of field of view possibly occurring at an imagingpoint picked up after the imaging position change through the stageshift/beam shift (for example, 1007 in FIG. 10B) can be anticipated. Inselecting various kinds of imaging points, by making an evaluation as towhether a pattern suitable for an intended process is included in anarea 1008 exclusive of a pattern that is caused to be outside the fieldof view on account of the shift of field of view as shown in FIG. 10B,selection of an imaging point invulnerable to the influence of the viewfield shift can be assured.

Enumerated as the user request specifications 515 are requestedpositioning accuracy 516 at the EP, requested picture quality 517 andrequested imaging time 518. The requested picture quality 517 includes arequest for focus, stigmatism and brightness/contrast necessary toacquire a clear image, a request for contamination generationsuppression and a request for permissible electron beam incident anglesat an evaluation point and various imaging points. Details of thepermissible electron beam incident angle will be described later withreference to FIGS. 14A to 14C. Necessity/needlessness of setting ofvarious imaging points, the coordinates, size/shape and imaging sequence(inclusive of imaging order and electron bema vertically incidentcoordinates) of various imaging points and the imaging position changemethod are so determined as to satisfy the requested specifications.Especially, to meet the requested positioning accuracy 516, thenecessity/needlessness of setting an AP, the coordinates thereof,size/shape at the AP, the imaging sequence at the AP and the imagingposition change method are adjusted, to meet the requested picturequality 517, the necessity/needlessness of setting AF, AST or ABCC, itscoordinates, its size/shape, its imaging sequence and the imagingposition change method are adjusted and to meet the requested imagingtime 518, the number of imaging operations at various imaging points,their size/shape and the imaging position change method are adjusted.

The history information 519 is a library of results and knowledge of oldprocesses and the information is consulted by the imaging recipeautomatic creation engine 501 to permit better imaging recipe creation.For example, by managing, as history information, information of animaging point or imaging sequence which failed to be imaged or processedin the past, a process can be allowed which does not create an imagingrecipe resembling an old unsuccessful imaging recipe. Conversely, aprocess can be allowed which upgrades the evaluation value orpreferential order in an imaging recipe resembling an imaging point orimaging sequence which succeeded in imaging or processing in the past.

2.1.2 Input Information or Output Information

Enumerated as the imaging point coordinates 521 are coordinates of AP,AF, AST and ABCC designated by reference numerals 522 to 525,respectively. These imaging points are set in association withindividual evaluation points EP[p], where p=1 to Np, Np≧1, and aplurality of imaging points for arbitrary processing can be set (forexample, addressing is made at or from two AP's and then an EP isimaged). The above condition is expressed by AP[p][q], AF[p][q],AST[p][q] and ABCC[p] [q] (q=1 to Nq, Nq≧1). The arrangement number pindicates ID's of a plurality of evaluation points set on a chip locatedon a wafer and the arrangement number q indicates ID's of templates forindividual processes routed when an arbitrary evaluation point EP[p] isobserved (the imaging points AP, AF, AST and ABCC are handled as one set(the imaging order and the presence or absence of imaging at eachimaging point are arbitrary) and the arrangement number q indicates anID of the set). But, as will be described later, arbitrary imagingtemplates can be shared by different EP's (for example, for EP[p1] andEP[p2] (p1#p2), AP[p1] [q1] and AP[p2] [q2] are equal). In addition,unnecessary AP[p][q], AF[p][q], AST[p][q]and ABCC[p][q] can be deletedarbitrarily from the imaging sequence.

Enumerated as the size/shape 526 of imaging area are sizes and shapes atAP[p][q], AF[p][q], AST[p][q] and ABCC[p][q] designated by referencenumerals 527 to 530, respectively. Generally, the shape at an imagingpoint is a square area like at the EP but for inclusion of pattern areaseffective for various processes or exclusion of areas liable to beinconvenient, it can be a rectangular area or other arbitrary shapes.The size/shape can be applied as input information or can be optimizedinside the imaging recipe automatic creation engine 501 so as to beoutputted. Further, a constraint condition can be imposed on thesize/shape of some imaging points (for example, the shape is restrictedto a rectangular area and the size is selected from the range of ** to** (nm)) and the size/shape of some imaging points or the size/shape ofother imaging points can be outputted.

The imaging sequence 531 designates which order the aforementionedEP]p], AP[p][q], AF[p][q], AST[p][q] and ABCC[p][q] are imaged orsubjected to various processes in. The imaging position change method532 designates a method for changing the field of view in individualimaging steps of the imaging sequence (stage shift or beam shift).

The imaging condition 533 includes probe current, accelerating voltageand scan direction of the electron beam. The registry template 535includes templates of imaging range (FOV) cut at the EP[p], AP[p][q],AF[p][q[, AST[p][q[ and ABCC[p][q] and in consideration of a shift offield of view, the template can be cut in a slightly larger dimension asnecessary. Not all templates at the EP[p], AP[p][q], AF[p][q], AST[p][q]and ABCC[p][q] are required to be registered but the template may beregistered as criteria of addressing and various processes only for animaging point which needs imaging parameters and a template as well.

As for registry template 535, one or more can be selected from six dataformats of CAD data at an imaging point, a CAD image obtained byimage-quantizing the CAD data, CAD data applied with a predeterminedprocess (to be described later), a CAD image applied with apredetermined process (to be described later), an SEM image and an SEMimage applied with a predetermined process (inclusive of an instance ofconversion to line segment information) and can be registered astemples. For example, in addressing, the data format of an effectiveregistry temple depends on a matching scheme between an actual imagetemplate used for addressing of an imaging point in the actual imagingsequence and a registry template and therefore from the standpoint ofspeedup of matching process and high accuracy of matching, theaforementioned selection of data format is efficient.

The database 536 is adapted to save/manage part or all of theinformation pieces 502 to 535 described previously. As for theaforementioned information, information on time series or distributedover different SEM apparatuses can be shared for handling. The imagingrecipe automatic creation engine 501 can read arbitrary information fromthe database 536 as necessary and reflect it on various kinds ofprocesses. In determining values or ranges of the various kinds of inputinformation 502 to 535, old parameters saved in the database 536 can beconsulted and besides, default values of the aforementioned values orranges can be saved in respect of individual kinds or fabrication steps,for example.

Among the above items, the imaging point or imaging sequence evaluationvalue or preferential order 534 will be described in greater detail. Theautomatic recipe creation method in the present invention featuresmaking a decision as to success/failure of imaging or process applied toan arbitrary imaging point. The method also features a relief processcarried out, when the imaging or process is determined to beunsuccessful in the success/failure decision, to change the imagingpoint and imaging sequence for the purpose of making the imaging orprocessing successful. Accordingly, according to a feature of theinvention, during the imaging recipe creation, a plurality of candidatesfor imaging sequence 531 applied to change the aforementioned imagingpoint coordinates 521, imaging point size/shape 526, imaging positionchange method 532 and imaging condition 533 are calculated and besides,evaluation values or preferential order of these candidates arecalculated. In the actual imaging sequence, imaging or processing isexecuted in accordance with an imaging point or imaging sequence havinga higher evaluation value or preferential order and when the imaging orprocessing is determined to be unsuccessful, the imaging template orimaging sequence is changed on the basis of the evaluation value orpreferential order.

Two examples of typified input/output combinations are extracted fromthe list of input/output information generally described in FIG. 5 areillustrated in FIGS. 6A and 6B. For example, in the example shown inFIG. 6A, the imaging recipe automatic creation engine 501 provides, asinput information, evaluation point information 502, design patterninformation 506, process parameter 511 and requested positioningaccuracy 516 and estimates, for output information, imaging pointcoordinates 521, imaging point size/shape 526, imaging sequence 531 andimaging position change method 532. In this case, only the positioningaccuracy 516 is designated as the user requested specifications 515 andthe imaging condition 533 is eliminated from both the input informationand output information. The example illustrated in FIG. 6B differs fromthe FIG. 6A example in that part of imaging sequence 531A, imagingposition change method 532, AP[p][q] size/shape 527A and AF[p][q]size/shape 528A are used as input information and residual imagingsequence 531B and residual imaging point size/shape 526B are used asoutput information.

As a concrete example, in the input information, a condition “An EP isimaged after addressing at an AP. The number of AP's is two at the most.An auto-focus process is necessarily carried out at an AF before imagingthe EP.” is set to the part of imaging sequence 531A, a condition “Onlyfor the first AP, the field of view is moved through stage shift andview field movements to the remaining templates are all done throughbeam shift.” is set to the imaging position change method 532, acondition “A size of a proper value within a range of 3 to 5 μm is setto the first AP and the AP's are all square areas.” is set to theAP[p][q] size/shape 527A and a condition “The AF size before EP imagingis the same as the EP size.” is set to the AF[p][q] size/shape 528B. Inthe output information, as the residual imaging sequence 531B andresidual imaging point size/shape 526B, “A particular size of the firstAP (within the range of 3 to 5 μm as above) and, if setting isnecessary, a size of the second AP and sizes/shapes of AST and ABCCC” isestimated. If necessary, for relief in the event of a failure in imagingor processing, a plurality of imaging points and a plurality of imagingsequences are outputted (as the imaging template changes over, theimaging sequence ought to be changed). Further, evaluation value orpreferential order of imaging point or imaging sequence 534 is alsooutputted.

The input information as above can be designated directly by the user orcan be inputted by reading a default setting saved in, for example, thedatabase 536. Many pieces of the aforementioned information given to theinput information can be information effective to imaging recipecreation but information permitted to be inputted or uncertaininformation differs depending on, for example, the kind, the productionprocess and the SEM apparatus. Some users will want to save the time andlabor of inputting. According to the invention, combinations of theinput/output information pieces can be set at will.

2.2 Imaging Sequence (Basic Sequence and Division of Imaging Point)

Referring to FIGS. 7A to 7G, examples of setting of imaging pointdisposition and imaging sequence in low magnification field of views 701a to 701 g will be described. In each figure, a dotted block indicatesan imaging range (FVO) of each imaging point registered in the imagingrecipe, a solid arrow indicates a stage shift, a dotted arrow indicatesa beam shift and encircled numerals 1 to 15 on the solid and dottedarrows indicate the imaging order. The following description will begiven by making reference to FIGS. 7A to 7G sequentially.

Especially illustrated in FIG. 7A is an example of imaging sequence forimaging an arbitrary p-th evaluation point EP]p] (706 a). Individualparameters (coordinates, size/shape, imaging condition and so on) ofEP[p] (706 a), AP[p][1] (702 a), AF[p][1] (703 a), AST[p][1] (704 a) andABCC[p][1] (705 a) are designated as imaging points in the imagingrecipe and besides, in connection with the EP[p] (706 a) and AP[p][1](702 a), registry templates are saved.

Firstly, movement to the AP[p][1] (702 a) is effected through stageshift (1 in the figure) and an imaged actual template is matched with aregistry template at the AP[p][1] to estimate (address) image shiftamounts in x and y directions. Next, movement to the AF[p][1] (703 a)through beam shift is effected (2 in the figure) to perform anauto-focus adjustment. The beam shift amount equals a differenceobtained by subtracting the imaging shift amount from the amount ofdisplacement from the AP[p][1] coordinates to the AF[p][1] coordinates.Subsequent movement to respective imaging templates through beam shiftis corrected by the imaging shift amount as in the case of the movementto the AF. Thereafter, movement to the AST[p][1] (704 a) is effectedthrough beam shift (3 in the figure) to perform an auto-stigmatismadjustment. Then, movement to the ABCC [p][1] (705 a) is effectedthrough beam shift (4 in the figure) to perform anauto-brightness/contrast adjustment.

In this example, for the AF, AST and ABCCC, any registry template is notsaved in the imaging recipe but the registry template may be saved alsoin connection with the AF, AST and ABCC and by making matching with anactually imaged actual imaging template, whether correct movement to theregistered imaging point is successful can be decided or a criterion ofprocess can be provided. In the process criterion, it is preferable thatfor the AF, the focus adjustment is so made as to make contrast ofwiring edge high but for preventing noise from being erroneouslyemphasized as an edge, an edge position is discriminated from theregistry template and an adjustment is made such that contrast of thewiring edge can be emphasized correctly. Finally, movement to theEP[p](706 a) is effected through beam shift (5 in the figure) andimaging is carried out.

It is to be additionally noted that the arrows indicative of beam shiftin the 2nd to 5-th imaging operations in FIG. 7A all originate from theAP[p][1] (702 a) to indicate that the field of view is moved to theindividual imaging points on the basis of the addressed coordinate valueat the AP[p][1]. In other words, for example, the AF[p][1] (703 a)directed by arrow 2 is observed and thereafter the view field movementto the next AST[p][1](704 a) is completed by making the beam shift fromthe AF[p][1] (703 a) by a displacement of AF[p][1](703 a)-AST[p][1] (704a). Advantageously, in the present invention, the imaging sequence asabove can be determined automatically.

Although setting is not exemplified in FIG. 7A, for the sake ofperforming good addressing at, for example, the AP[p][1](702 a), an AFfor the AP[p][1] (702 a) can be set and an auto-focus adjustment can bemade at the AF before imaging the AP[p][1] (702 a). To inscribe imagingpoints in this case, the AF for AP[p][1] (702 a) is indicated byAF[p][1] and the AP[p][1], AF[p][1], AST[p][1] and ABCC[p][1] shown inFIG. 7A are rewritten to AP[p][2], AF[p][2], AST[p][2] and ABCC [p][2],respectively.

In FIG. 7B, an example of setting two AP's is illustrated. Stage/beamshift and addressing are carried out in the same way as that in FIG. 7Aand will not be described herein. In FIG. 7B, AP[p][1](703 a) isselected as the initial AP but in the AP[p][1], only a wiring pattern702 b elongated in x direction exists. Actual image templates 708 b and710 b both show cases which will possibly occur when coordinates ofAP[p][1] (703 b) are observed with the SEM in the actual imagingsequence. In the case of observed image 708 b, an actually formed wiringpattern 709 b substantially equally positioned to the correspondingdesign data 702 b with the exception that the line end on the right endside is rounded. In the case of observed image 710 b, however, an actualwiring pattern 711 b is largely contracted, as compared to the designdata 702 b complemented by dotted line in the figure, owing tofluctuations in the production process parameters (the gap is indicatedby arrow 712 b).

When, in the object as above, the positional shift amount estimationbased on matching between registry template 703 b and actual imagetemplate 710 b is conducted, matching is done with a shift correspondingto the gap 712 b and even if no positional shift amount exists ineffect, there is a deficiency that a positional shift amountcorresponding to the gap 712 b is detected erroneously. In other words,because of the shortage of the edge in x direction the pattern has inthe AP[p][1](703 b), the accuracy of addressing using the AP[p][1](703b) will possibly be degraded. When taking this point into account, animaging point containing many patterns changed in both the x and ydirections should preferably be selected as an AP. However, an APsatisfying the aforementioned condition within the area (FOV) 701 b onthe presupposition of the size/shape of the imaging point given byAP[p][1] (703 b) does not exist (but depending on the degree ofdeformation possibly occurring in an actual pattern, good addressing inboth the x and y directions can sometimes be assured only with theAP[p][1] (703 b)).

Therefore, division of imaging point and setting of imaging sequence canbe conceived, according to which two AP's such as AP[p][1](703 b) andAP[p][2](705 b) are set and for example, addressing in the y directionis once effected at AP[p][1](703 b) and subsequently addressing in the xdirection is effected at AP[p][2](705 b). In the example shown in thefigure, for addressing in the y direction, movement to AP[p][1](703 b)is first effected (movement 1 in the figure), followed by adjustment ofboth auto-focus and auto-brightness/contrast at the counterpartcoordinates of AF[p][1] and ABCC[p][1](704 b) (movement 2 in thefigure), movement to AP[p][2](705 b) for addressing in the x direction(movement 3 in the figure), readjustment of auto-focus at AF[p][2](706b) (movement 4 in the figure) and final movement to EP[p](707 b)(movement 5 in the figure) for imaging. Further, in case the accuracy ofstage positioning, for example, is bad or a plurality of AP's havingdifferent imaging magnifications are set, a plurality of addressingpoints need to be disposed. More specifically, even when a largepositional shift takes place through stage shift during AP imaging, AP'sare once imaged at a very low magnification so that many patternsassociated with the AP's may be confined within the field of view andthereafter addressing may be effected.

With the AP's imaged at the low magnification, the accuracy ofaddressing is low because of the low magnification. Hence, an AP reachedthrough beam shift is then imaged at a high magnification and detailedaddressing is effected. As will be seen from the above, the presentinvention features that for making imaging successful, a plurality ofarbitrary imaging points are disposed as necessary. In addition, thepresent invention also features that the disposition of plural imagingpoints is decided automatically as to whether to be necessary or notfrom CAD data or apparatus condition and if necessary, the pluralimaging points are selected automatically.

Illustrated in FIG. 7C is an example where an AP shape other than asquare is set. For example, when the size/shape of an imaging rangegiven by an imaging point 708 c is presupposed, setting of an AP havinghigh accuracies in both x and y directions is difficult to attain with asingle AP. Accordingly, by enlarging the aforementioned size, an APcontaining both a pattern having many edges in the x direction and apattern having many edges in the y direction can be set. Moreover, inaddition to the mere enlargement of the size of the imaging point, theshape of imaging range can be optimized such that edge lengths in x andy directions necessary for highly reliable addressing (for example, 706c, 707 c) can both be included as shown at AP[p][1](704 c) (an arbitraryshape other than the rectangle is settable). The edge lengths 706 c and707 c necessary for highly reliable addressing can be given byconsulting a necessary condition for the selective factor index value(threshold value) which is one value of the selective processingparameter 512 the input information includes and the shape discrepancyestimative amount 513 between a design pattern and an actual pattern.

2.3 Imaging Sequence 2 (Sharing of Imaging Point and Optimization of EPImaging Order)

Illustrated in FIG. 7D is an example where imaging points are shared bya plurality of different EP's. In this example, an imaging recipe forobservation of EP[1](705 d) and an imaging recipe for observation ofEP[2](707 d) are used in common as far as possible. Firstly, addressingis effected to AP[1][1](702 d) (movement 1 in the figure), followed byan auto-brightness/contrast adjustment at ABCC[1][1](703 d) (movement 2in the figure), an auto-focus adjustment at AF[1][1](704 a) (movement 3in the figure) and then movement to EP[1](705 d) for imaging (movement 4in the figure). In connection with the subsequent imaging at theEP[2](707 d), addressing thereto has already been finished with theAP[1][1](702 a) and besides the EP[2](707 d) is at a distance from thecoordinates of the AP[1][1] through which movement based on beam shiftis possible, thus omitting readdressing. In this example, theauto-brightness/contrast adjustment is also considered as not beingchanged largely after the execution at the ABCC[1][1] (703 d) and istherefore omitted. The auto-focus adjustment in this example is,however, considered to be executed again before imaging at the EP[2] andso an auto-focus adjustment is made at AF[2][1](706 d) (movement 5 inthe figure).

Finally, movement to the EP[2](707 d) is effected (movement 6 in thefigure) and imaging is carried out. In this manner, the imaging pointscan be shared by the plurality of different EP's and as a result, thenumber of imaging operations can be reduced, thereby promoting thethroughput of imaging as a whole. Therefore, the present inventionfeatures that in choosing various imaging points, the imaging pointwhich can be shared by the plural EP's as far as possible, such as theaforementioned AP[1][1](702 d), is set. This can be applicable in asimilar manner to the common use of an arbitrary imaging point (for anarbitrary q, common use of part or all of AP[p][q], AF[p][q], AST[p][q]and ABCC[p][q]) and the sharing by three or more EP's.

Illustrated in FIG. 7E is an example where an imaging point is shared bya plurality of different EP's and correspondingly, the order of imagingthe plural EP's is optimized. In this example, twelve EP[p]'s (p=1 to 12and p being an ID allotted to each EP at will; and designated by 701 eto 712 e sequentially) are indicated and like the common use of imagingpoint explained previously with reference to FIG. 7D, AP[1][1](713 e)shared by the EP[1], EP[2], EP[7] and EP[8], AP[3][1](714 e) shared bythe EP[3], EP[4], EP[9] and EP[10] and AP[5][1](715 e) shared by theEP[5], EP[6], EP[11] and EP[12] can be set. In this example, movementfrom the AP shared by the EP's to these EP's can be done through beamshift but the distance between adjacent AP's is large and movementtherebetween is effected through stage movement.

In this example, when considering the order of imaging the EP[p]'s (p=1to 12) by which high throughput can be attainable from the standpoint ofthe number of imaging operations, the number of processing operationsand the moving distance, an order indicated at 1 to 15 in the figure (anorder of EP[1], EP[2], EP[8], EP[7], EP[3], EP[4], EP[10], EP[9], EP[5],EP[6], EP[12] and EP[11]) is one of suitable imaging orders. In thisimaging order, an arbitrary AP is observed and thereafter all EP'smovement, to which is possible from the AP through beam shift, are allimaged sequentially, so that reiterative addressing using the same AP isunneeded and the total stage moving distance can be minimized (in thisexample, the stage movement is done in an order of AP[1] [1] (713a)→AP[3] [1] (714 e)→AP[5][1](715 e) and is shorter than, for example,AP [1][1] (713 e)→AP [5] [1] (715 e)→AP [3][1] (714 e) ). As will beseen from above, in the present invention, the order of imaging aplurality of evaluation points can be optimized and the high throughputcan be attained to advantage.

2.4 Imaging Sequence 3 (Relief Function)

Illustrated in FIG. 7F is an example of a relief function at the time ofa failure in imaging. In this example, an imaging sequence is set inwhich addressing to AP[p][1](703 f) is first effected (movement 1 in thefigure), followed by subsequent movement to EP[p](704 f)(movement 2 inthe figure) for photographing. In the figure, the third arrangementnumber in the AP[p][1][1] indicates a number of candidate for imagingpoint (for AP[p][q][r] indicates an r-th candidate regarding AP[p][q]).But, when imaging the AP[p][1][1](703 f) actually, there is apossibility that a pattern to be as original is not formed owing to afailure as shown at, for example, an actual image template 709 f (in thefigure, for a design pattern 702 f indicated at dotted line, a pattern708 f is actually formed) and because of such inconvenience, addressingfails.

Then, candidates for a plurality of different imaging points or imagingsequences are calculated in advance or at the time of occurrence of thedeficiency and the processing is switched, thereby making it possible tomake imaging of EP successful. Here, as an example of AP substitutingfor the AP[p][1][1](703 f), AP[p][1][2](706 f) is indicated. In theevent that addressing to the AP[p][1][1] (703 f) is determined to beunsuccessful through the success/failure decision, movement to the nextAP[p][1][2](706 f) is effected (1′ movement in the figure) andaddressing is done. If a wiring pattern 705 f is formed without defectand the processing succeeds, movement to the EP[p](704 f) is effected(movement 2′ in the figure) for imaging. Further, as describedpreviously, in order to determine how to exchange the candidates forimaging points or imaging sequences, evaluation values or preferentialorders of the imaging points or imaging sequences are calculated and onthe basis of the evaluation values or preferential orders, automaticchangeover can be carried out.

As described above, the present embodiment features that for the sake ofmaking imaging successful, the success/failure decision is made inprocessing at an arbitrary imaging point. Further, by selecting aplurality of candidates for the imaging point or reselecting them asnecessary, the imaging point can advantageously be changed over in theevent that the processing is determined to be unsuccessful through thesuccess/failure decision. This can also be applied to AF, AST and ABCCin a similar way.

Illustrated in FIG. 7G is an example showing the relief function in theevent of a failure in imaging. In the present example, the imagingsequence can be changed to a great extent by changing over the imagingpoint at the time of relief operation. When addressing is effected toAP[p][1][1](703 g) of high preferential order, for example, (movement 1in the figure) as in the cased of FIG. 7F and the processing fails,movement to AP[p][1][2](706 g) of next high preferential order (1′ inthe figure) and addressing is effected. In the present example, however,a pattern at the AP[p][1][2] has less edge in the x direction and soAP[p][2][2](708 g) needs to be added (movement 2′) in order to performaddressing in the y direction. In other words, it is necessary in thisexample that in addition to the mere change of the AP from AP]p][1][1]to AP[p][1][2], a new template be added (change from 1→2 to 1′→2′→3′).

The deficiency in FIGS. 7F and 7G is a failure in addressing but in theevent that deficiency takes place otherwise in imaging or processingoperations, the relief can also be taken in a similar way. As describedabove, in the present embodiment, for the sake of making imagingsuccessful, the success/failure decision is made in processing at anarbitrary imaging point and if the processing is determined as beingunsuccessful in the success/failure decision, the imaging point orimaging sequence is switched over. This can also be applied to AF, ASTand ABCC in a similar way.

Next, with reference to FIG. 7G, an example of a method of decidingwhich imaging point is to be switched over when imaging or processingfails will be described.

An instance will be considered in which when AP[p][2][2](708 g) isactually imaged as indicated at actual image template 710 g, addressingfails because in relation to a design pattern 707 g indicated at dottedline in the figure, an actually formed pattern 709 g deforms to a largeextent. If the actual imaging position 710 does not displaced largelyfrom coordinates of the scheduled imaging point AP[p][2][2](708 g), itwill be considered that a pattern deformation of AP[p][2][2] (708 g) isproblematic and as a relief function, a process for changing theAP[p][2][2](708 g) to a different imaging point (not shown) may bethought of.

On the other hand, an instance will be considered in which when imagingthe AP[p][2][2](708 g) actually as shown at the actual imaging template713 a, an actually formed pattern 711 g does not change largely inrelation to the design pattern 707 g but addressing fails on account ofa large shift of the field of view. In this case, since movement to theAP[p][2][2](708 g) is based on the result of addressing to theAP[p][1][2](706 g), there is a high possibility that addressing to theAP[p][1][2](706 g) fails (or there is a possibility that an addressingbefore the addressing to AP[p][1][2](706 g) such as global alignment notshown fails but this is not handled by the present invention).Accordingly, in order for addressing to succeed, the AP[p][1][2](706 g)is exchanged with a different point (not shown) (in this case, theensuing imaging sequence is also changed and the use of theAP[p][2][2](708 g) will possibly be prevented) or the size/shape of, forexample, the AP[p][2][2](708 g) is changed so as to be exchanged withthe imaging point as shown at AP(713 g), thereby ensuring that even whena slight shift of imaging is generated in the y direction, addressing inthe x direction based on the imaging point can be permitted because anedge length necessary for highly reliable addressing (for example 714 g)cam be included in the imaging point.

As described above, the relief processing differs depending on causes ofa failure. In the present invention, by adding the function to estimatecauses of a failure to the success/failure decision, a more effectiverelief process can be selected in compliance with the failure cause.But, only the success/failure decision of imaging or processing iscarried out (without estimating the cause of failure) so that in theevent of a failure, a simplified relief process for mechanicallyswitching the process to a different imaging point or imaging sequencecandidate may be taken. The contents of processing in the relief processas above can be set by the operator, automatically set in the system orset by the operator on the basis of the contents processed automaticallyin the system.

Referring now to FIG. 8, the overall imaging sequence including therelief function will be described. Firstly, in step 801, an globalalignment is carried out to correct positional shift and rotation of awafer mounted to the SEM apparatus. Thereafter, individual evaluationpoints EP[p] (p=1 to Np, Np≧1) are observed but the order of imagingdoes not always coincide with the order of ID's as shown in FIG. 7E. Instep 802, p is rewritten with an ID of an evaluation point to beobserved and the evaluation points are observed in accordance with theensuing steps until observation of all evaluation points ends in step836.

To assure good observation of the EP[p]'s, steps 803 to 829 participatein the program, whereby movement to AP, AF, AST and ABCC is effected asnecessary as explained in connection with the examples of imagingsequence shown in FIGS. 7A to 7G in order that addressing (step 805),auto-focus adjustment (step 811), auto-stigmatism adjustment (step 817)and auto-brightness/contrast adjustment (step 823) can be performed.After completion of the addressing, auto-focus adjustment,auto-stigmatism adjustment and auto-brightness/contrast adjustment andEP imaging as well, a decision can be made as to whether the imaging orprocessing is successful and a relief process can be carried out incorresponding steps 806 to 809, steps 812 to 815, steps 818 to 821,steps 824 to 827 and steps 832 to 835. Here the process steps 806 to 809following the addressing will be picked up and explained but theremaining steps may be understood similarly.

Firstly, after addressing (step 805), the addressing is decided in step806 as to whether to be successful or not (this success/failuredecision, however, includes a success/failure decision applied to aprocess other than the immediately preceding process. For example, incase focus adjustment in an EP image is insufficient, a focus adjustmentcarried out at an AF before the acquisition of the EP image isdetermined to be insufficient). For example, criterion for thesuccess/failure decision is so prescribed as to determine a failure inaddressing on the basis of such a phenomenon that when, in theaddressing, the shift amount of maximum correlation position in thematching between an actual image template and a registry template islarge, the maximum correlation value is low, the correlationdistribution in the vicinity of the maximum correlation position is verygradual (there is a possibility that the maximum correlation positionwill be caused to change largely by a slight noise and the reliabilityof the estimative value of positional shift is low) or wiring patternshapes in the two templates differ greatly from each other. Then,addressing success is determined, movement to the next imaging point ispermitted (step 811 and ensuing steps) but a failure in accessing isdetermined, a method for changing the imaging point or imaging sequenceis determined in step 807. For the purpose of determining the changemethod, causes of the failure can also be presumed and an efficientchange method can be selected in accordance with the cause of failure.

Subsequently, when the change method is settled, the imaging point orimaging sequence is changed and p and q are changed as necessary in step808 and thereafter, the program jumps to any one of steps 801, 805, 811,817 and 823 to continue the imaging sequence. If no imaging point orimaging sequence change method necessary for relief is settled in thestep 813, a failure in imaging results (step 815). Even in that case,the failure in imaging can be recognized and an exceptional process forexempting the failed EP image from analysis in the succeeding processcan be executed. Information concerning the imaging point for whichimaging or processing is successful or unsuccessful can be stored in,for example, the database 536 in FIG. 5, having linkage to thecoordinate or template of the imaging point, the success/failure resultor the causes of failure and can be used as history information to beconsulted or utilized in the succeeding recipe creation.

In FIG. 8, the order of step blocks 810 (steps 811 to 815), 816(steps817 to 821) and 822 (steps 823 to 827) corresponding to the auto-focusadjustment, auto-stigmatism adjustment and auto-brightness/contrastadjustment, respectively, can be exchanged with one another arbitrarily.In respect of arbitrary p and q (p represents ID of evaluation point andq represents ID of imaging template routing in association with eachevaluation point), a process of step blocks 804 (steps 805 to 809), 810(steps 811 to 815), 816 (steps 817 to 821) and 822 (steps 823 to 827) inarbitrary combination can be omitted.

2.5 Overall Process Flow

The overall process flow of the imaging recipe creation is summed up inFIG. 4. Firstly, in step 401, a combination of input/output informationpieces is designated. Specifically, an arbitrary combination of thepieces of input/output information described in connection with FIG. 5is possible. The input/output information combination can be set by theoperator at will or a combination of defaults inside the system can beused. The default combination can be prepared in respect of a kind ofwafer representing an object to be inspected or in respect of theindividual steps. Next, the designated input information 402 isinputted. The input information includes at least coordinates 403 ofevaluation points EP[p](p=1 to Np, Np≧1) and CAD data 404. In addition,various other parameters 405 correspond to part of information pieces502 to 536 designated as input information in FIG. 5. The coordinates ofthe evaluation point can be determined by detecting critically deficientpoints on a semiconductor pattern required to be inspected through, forexample, pattern formation simulation in circuit design using, forexample, an electronic design automation tool: ED tool) and causing theoperator to conduct sampling from the detected deficient points. On thebasis of the input information, the imaging point, the imaging sequenceand the like are calculated (step 406. Corresponding to that in theimaging recipe automatic creation engine 501 in FIG. 5), outputinformation 412 is outputted. In FIG. 4, three of the imaging point 413,imaging sequence 414 and evaluation value or preferential order 415 ofthe imaging point or imaging sequence are enumerated as the outputinformation but through designation in the step 401, desired pieces ofinformation among information pieces 521 to 534 in FIG. 5 can becalculated/outputted. In the step 406, on the basis of the EP[p]coordinates 403 and the movable range or forbidden range of beam shift,search ranges of various imaging points are set (step 407) and imagingpoints (AP/AF/AST/ABCC) are calculated (step 408).

In the step 408, the imaging point and imaging sequence are optimized(optimization of the order of EP imaging is also involved). In the stepblock 408, processing can be executed as necessary including thedivision of imaging point exemplified in FIG. 7B, the optimization ofimaging sequence inclusive of common use of imaging points exemplifiedin FIGS. 7D and 7E (step 409 also including the optimization of EPimaging order), the optimization of the size/shape of imaging pointexemplified in FIG. 7C (step 410), and the calculation of pluralcandidates for imaging point or imaging sequence exemplified in FIG. 7G(step 411). The output information 412, along with templates selected inthe step 406 (cut out in step 417), is registered in an imaging recipe(step 418). Also, as necessary, candidates for other imaging points orimaging sequence calculated in the step 411 are registered in theimaging recipe in the step 418, registered in a different imaging recipeor managed in a database 416. In an actual imaging sequence, imaging isconducted on the basis of the aforementioned imaging recipe (step 419).If the imaging or processing of a desired imaging point in the step 419(addressing, auto-focus adjustment, auto-stigmatism adjustment orauto-brightness/contrast adjustment) is determined to be unsuccessful instep 420, switchover to an imaging point or imaging sequence prepared inthe step 418 is effected so as to make imaging or processing succeed.

3. Imaging Recipe Automatic Creation Engine

Next, an embodiment of the imaging recipe automatic creation engine 501will be described.

3.1 Outline of Creation Engine

Referring now to FIG. 9, a method of evaluating/selecting a desiredimaging point inside an imaging recipe creation engine 903 (501 in FIG.5) will be described by way of example of AP selection. To sum up theprocess, for selection of an AP, it is necessary to evaluate if apattern inside a desired AP is a suitable one for addressing, so that inthe light of a plurality of consideration points including, for example,(1) a pattern change suitable for addressing is present in the AP (indexof complexity. Distribution of the index 911), (2) because of theabsence of a pattern similar to that of the AP in the vicinity of theselected AP, matching will not probably fail during addressing (index ofpeculiarity. Distribution of the index 912) and (3) the AP is locatednear an evaluation point EP (index of distance. Distribution of thedistance 913), various index values at a desired imaging point candidatelocation are calculated (hereinafter, called selective factor indexvalues), thus ensuring that the imaging point candidate is evaluated onthe basis of the factor index values to select a proper imaging point.

3.1.1 Contents of Processing (Selective Factor Index Values)

The individual processing steps will be described in greater detail.Firstly, as circuit design data, CAD data 901 and EP 902 are inputted(corresponding to 404 and 403 in FIG. 4, respectively, with inputinformation corresponding to values or range 405 of various parametersnot illustrated in FIG. 9). In step 904, the CAD data 901 is convertedinto image data 905 (hereinafter referred to as CAD image. Details ofthis step will be described later with reference to FIGS. 12A and 12B).

Next, in step 907 in FIG. 9, a selective factor index value at eachimaging point candidate is calculated. In FIG. 9, distributions 911 to913 of three selective factor index values are illustrated as an examplebut an arbitrary number of selective factor index values designedpursuant to various evaluation criteria can be calculated. In each ofthe selective factor index value distributions 911 to 913, the value ofeach selective factor index value when the center of an AP exists atarbitrary x and y coordinates (x, y) in the CAD data coordinates isexpressed in terms of wire frame (a coordinate system indicatingevaluation positions can also be expressed by x and y coordinates (Ix,Iy) in the CAD image as a result of conversion of the CAD data into animage which substitutes for arbitrary x and y coordinates in the CADdata coordinates). As will be described later, from the standpoint ofrequired calculation accuracy and calculation time, the selective factorindex value can be calculated by using CAD data 901 as input informationor by using CAD image 905 as input information.

In step 908, the selective factor index value is calculated using theCAD data 901 as input information and in step 909, it is calculatedusing the CAD image 905 as input information. In step 910, however, theselective factor index value is calculated using neither the CAD data901 nor CAD image 905 as input information. Although, in the steps 908to 910, only respective ones of selective factor index values 911 to 913are illustrated, a plurality of arbitrary selective factor index valuescan be calculated in an arbitrary one or ones of the steps 908 to 910and, like the illustrated selective factor index values, can be used asmaterials for decision of imaging point selection. In each of theselective factor index value distributions 911 to 913, the larger thevalue (the value in z direction orthogonal to the x and y axes beinglarger), the better the obtained evaluation can be but the relationbetween the magnitude of index value and the quality (better/worse) ofevaluation can be changed in respect of individual selective factorindex values.

For example, in a conceivable method of collectively deciding theplurality of selective factor index values to select a selecting(imaging) point, an overall selective index value is calculated(distribution of the index values is designated at 927) from the linearsum, designated at 926, of the selective factor index values (a valueobtained by multiplying the individual factor index values 911 to 913 byweights w1 to w3 (923 to 925 and adding the products) and an imagingpoint is determined on the basis of the overall selective index value(for example, an imaging point centered on coordinate values (Xap, Yap)928 at which the overall selective index value is maximal is determinedas an AP).

An example of the AP selected through the above process is illustratedat lower part of FIG. 9. The AP can be delivered as either a range orFOV 929 on the CAD data 901 or a range 930 on the CAD image 905. Theweights w1 to w3 are of one type of selective process parameter 512 inFIG. 5 and advantageously, by changing the weight, the selectioncriterion of various imaging points can be customized. The AP selectionprocess shown in FIG. 9 can be applied in a similar way to selection ofthe imaging points AF, AST and ABCC other than the AP by making anexchange with selective factor index values for evaluating a criterionto be satisfied by each imaging point.

From values of the selective index value 927 or selective factor indexvalues 911 to 913, propriety of an arbitrary imaging point can beevaluated quantitatively and so evaluation values or preferential orderat the plural candidates for imaging point or imaging sequence can becalculated. Further, through the decomposition into indexes and theevaluation in consideration of plural points of view as in the case ofthe selective factor index values, an arbitrary imaging point can bedecided as to mere its propriety/impropriety and besides causes of thepropriety/impropriety can be analyzed and therefore the arrangement ofimaging points and the determination of imaging sequence can be settled.

3.1.2 Contents of Process (Forbidden Area)

By using setting of a forbidden area for objects excluded from theimaging point selection in combination with the above-describedselection process, high accuracy of selection can be attained. Adescription will be given of the forbidden area hereunder.

Firstly, by setting a forbidden area in consideration of the beam shiftmoving range and a forbidden area in consideration of the influence ofcontamination at the EP, candidates for an imaging point to be selectedcan be restricted (step 921). In an example of the forbidden area inconsideration of the beam shift movable range, when movement is requiredfrom an arbitrary selected imaging point, for example, AP[1][1](1302) toEP[1](1303) through beam shift as shown in FIG. 13A, the range ofsearching the AP is set to the interior of a beam shift movable range1304 centered on the EP[1](1303). In this case, a forbidden area isgiven as hatched area 1305 to keep an imaging point such as AP frombeing selected from the interior of area 1305. Thus, an AP selected fromthe interior of area 1304 satisfies a condition for movability to the EPthrough beam shift.

In another example of the forbidden area, when especially selecting animaging point to be picked up at a high magnification with the aim ofrestraining deposition of contamination on, for example, EP[1](1303)(with the electron beam irradiated on the specimen for a long period oftime, a contaminative substance is deposited on the specimen), animaging area for the EP[1](1303) and its neighboring area 1306 can beset as a forbidden area (the imaging range of the EP is prohibited fromoverlapping an imaging range of a different imaging point. Setting ofthe neighboring area is effected in order that even if a slightpositional shift occurs at the different imaging point, overlapping onthe EP can be avoided). The search range and the forbidden area can bedesignated by the user at will or by a rule of default in the system(one of values of selection process parameter 512 in FIG. 5).

Further, the aforementioned forbidden area for restraining thecontamination deposition can be set in consideration of a plurality ofEP's. As an example to this effect, an instance will be considered inwhich as shown in FIG. 13B, imaging is first effected at EP[1](1303) andthereafter, EP[2](1307) representing the next evaluation point isimaged. If, in the course of selection of an AP for the EP[1](1303), theAP is searched on the condition that only the forbidden area 1306provided nearby the EP[1](1303) is avoided as has been explained inconnection with FIG. 13A, there is a danger that an AP[1][1](1309), forexample, is selected as the AP. Through imaging of the AP[1][1](1309),contamination will be deposited within an imaging range of theEP[2](1307) to be imaged subsequently and therefore selection of theAP[1][1](1309) is not reasonable for imaging of the EP[2](1307).Accordingly, in selecting an AP for the EP[1](1303), the AP[1][1] mustbe selected on the condition that both a set of imaging area EP[1](1303)and its neighboring forbidden area 1306 and a set of imaging areaEP[2](1307) and its neighboring forbidden area 1308 are avoided. Theabove forbidden area setting method can be applicable similarly to thecase where three or more EP's are considered or selection of AF, AST andABCC is effected.

The present embodiment features setting of a forbidden area inconsideration of plural EP's. Distribution of forbidden areas setaccording to the teachings of FIGS. 13A and 13B is indicated atforbidden area 921 in FIG. 9. In the forbidden area 921, (x, y)coordinates of imaging points prohibited for selection are indicated inblack. This type of indication method is also applicable to forbiddenareas 918 to 920 to be described later.

Next, a forbidden area to be set by using the selective factor indexvalue will be described. For example, in respect of individual selectivefactor index values 911 to 913, evaluation values to be satisfied at theleast for an imaging point (here AP) are set as threshold values Th1 toTh3 (914 to 916), respectively, imaging points having selective factorindex values not satisfying the above threshold values are set asforbidden areas so as to be excluded from candidates and an imagingpoint can be determined from the residual candidates on the basis of theselective factor index value 927. The threshold values Th1 to Th3 areone of values of selective process parameter 512 in FIG. 5 and bychanging the threshold values, the selection criteria for variousimaging points can be customized to advantage. Candidates below thethreshold values Th1 to Th3 (914 to 916) set for the selective factorindex values 911 to 913 are set as forbidden areas, as exemplified at918 to 920 in FIG. 9. In the figure, areas in which the selective factorindex values do not satisfy the criteria are forbidden areas asindicated in black. In this example, the area of less than the thresholdvalue is set as the forbidden area but, in some case, depending ondesigned selective factor index value, the smaller the value, the betterthe evaluation can be and in this case, an area of larger than thethreshold value is set as a forbidden area. Further, as typified by theforbidden area 920 corresponding to the selective factor index value913, setting may also be made such that no forbidden area is setdepending on the threshold value. A forbidden area 931 is the logicalsum of the forbidden area 921 and the forbidden areas 918 to 920corresponding to the individual selective factor index values and an APis selected from an area exclusive of the forbidden area 931.

3.2 Selective Factor Index Value

There are plural selective factor index values (three are exemplified inFIG. 9) as described previously and the present invention features thatfor calculation of the selective factor index values, the CAD data orCAD image is selectively used as input information in respect of theindividual selective factor index values. Namely, the CAD data is thecoordinate data that has highly accurate coordinates but has onlycontour information as data, being unsuitable for evaluation of atwo-dimensional pattern. On the other hand, the CAD image is of aqunatized image that has lower shape accuracy than the CAD data but iseffective to evaluate the matching characteristic of two-dimensionaltemplates. Further, depending on the contents of processing, theprocessing speed sometimes differs for the CAD data and CAD image. Aswill be seen from the above, the data format (coordinate data or imagedata) for expressing design data is advantageous or disadvantageous fromthe viewpoint of the processing accuracy or processing speed for anarbitrary processing and hence in the calculation of the selectivefactor index value, information of different data format such as CADdata or CAD image is utilized selectively in accordance with theselective factor index value to calculating the selective factor indexvalue, thereby assuring compatibility between a proper index valuecalculation accuracy and a proper calculation speed.

Enumerated in FIG. 9 are an example where the index value is calculatedby using the CAD data as input information in the selective factor indexvalue 911 blocked at 908, an example where the index value is calculatedby using the CAD image as input information in the selective factorindex value 912 blocked at 909 and an example where the index valuewithout resort to input information in the form of the CAD image and CADdata for calculation is indicated in the elective element index value913 blocked at 910.

These combinations are a mere example and as the case may be, theselective factor index value 912 can be so set as to be calculated byusing the CAD data as input information. Although not illustrated, therecan possibly be a selective factor index value using both the CAD dataand CAD image. Furthermore, in FIG. 9, only one kind of selective factorindex value is calculated in each of the blocks 908 to 910 but there canpossibly be a case where a plurality of kinds of selective factor indexvalues are calculated or a case where no index value is calculated.

Turning to FIG. 10(a), there are illustrated CAD data 1001 in whichareas possible movement thereto from EP 1002 are cut out, and positionsof candidates for imaging points to be evaluated (represented by 5×5=25template areas typified by a dotted block at 1005). The number, size(1004)/shape (square area in the figure) of the imaging point candidatesto be evaluated and the distance (1003) of an imaging point to beevaluated to an adjacent one can be set at will. Depending on the sizeor distance of the imaging point, areas of the imaging point candidateswill sometimes overlap on one another. The imaging point candidate 1005in FIG. 10(a) is illustrated exaggeratedly in FIG. 10B. For example, inselecting an AP, it is decided whether an addressable pattern issufficiently included in an area of the imaging point candidate. At thattime, in consideration of a view-field shift for an imaging point due tothe positioning accuracy of the imaging position change method (stageshift or beam shift), an estimative amount of view-field shift 1007(part of the apparatus conditions 514 in FIG. 5) is given so that theimaging point size 1004 may partly be cut by the view-field shiftestimative amount 1007 and a selective factor index value may becalculated from only a pattern included in an inner area 1008, therebyensuring that an imaging point free of imaging failure and processingfailure can be selected to advantage even if the view-field shiftoccurs. In FIG. 10(b), a pattern 1006A is contained in the imaging pointcandidate area 1005 but only a partial pattern 1006B of pattern 1006A,which can be included in the field of view without fail even in thepresence of the view-field shift estimative amount 1007, is evaluated asto whether to be a pattern suitable for addressing.

Next, a variation of the CAD data or CAD image serving as an input whenthe selective factor index value is calculated will be described. As anexample, CAD data 1201 of a ring-form pattern is illustrated in FIG. 12A(indicated by apexes of pattern contour and dotted line connectingadjacent apexes). In an actual pattern, there is a possibility that thepattern is so deformed as to have its corners rounded as compared to theCAD data because of variations in manufacture parameters. If the patternshape is evaluated from only the CAD data without taking such adiscrepancy in shape between the CAD data and the actual pattern, thereis a danger that the accuracy of calculation of the selective factorindex value is degraded. Accordingly, for approximation to the actualpattern shape, modified CAD data 1202, for example, is created byobliquely cutting corners of the CAD data 1201 and by using the modifiedCAD data 1202, a selective factor index value can be calculated.Otherwise, a location where there is a high possibility that thediscrepancy between the CAD data and the actual pattern becomes largecan be excluded from evaluation at the time of calculation of theselective factor index value.

Modifying methods other than the aforementioned oblique cutting ofcorners may be enumerated including rounding corners or thinning theoverall pattern and the kind of method and the degree of modificationcan be set arbitrarily (the modifying method and degree can bedesignated according to the shape discrepancy estimative amount 513between the design pattern and the actual pattern in FIG. 5). A CADimage 1203 can be created from either the CAD data 1201 or the modifiedCAD data 1202. Further, from the created CAD image 1203, for example, aCAD image 1204 can be created having its pattern zone painted on thebasis of mask extraction residue information (508 in FIG. 5) or amodified CAD image 1205 applied with image processing such as asmoothing process can be created. In FIG. 12A, the images 1202, 1204 and1205 can be omitted in arbitrary combination. For calculation of theselective factor index value, the data 1201 to 1205 can be taken inarbitrary combination so as to be used as input information in respectof each selective factor index value.

Turning now to FIG. 12B, a method of creating a CAD image from CAD datawill be described by way of example of creation of a CAD image 1203 fromthe CAD data 1202. In making an image, the screen is divided by an imagequantization width 1206 into a pixel lattice and a pixel, over which aline segment of the pattern 1202 exists, is changed in its brightness tomake an image (as exemplified by hatched pixel 1207). The imagequantization width (pixel/nm) 1206 (one of processing parameters 512 inFIG. 5) is geometrically dimensioned so as to keep an arbitraryanalytical process (imaging process to be executed after imageconversion) from being put to inconvenience.

By making reference to FIGS. 14A to 14C, an example of selection of ashared AP will be described by way of an instance where an imaging pointis shared by a plurality of different EP's as exemplified in FIGS. 7Dand 7E. In the case of evaluation of an AP candidate sharable by theplural EP's, too, various selective factor index values are calculatedin essentiality for individual AP candidates as in the case of selectionof AP for a single EP described previously and the AP selection isconducted on the basis of the index value. In FIG. 14A, a common AP 1403is selected for sharing by two EP's 1404 and 1405, whereby addressing tothe common AP 1403 is carried out by movement thereto through stageshift and thereafter sequential movement to the EP's 1404 and 1405 isconducted through beam shift, followed by imaging thereat.

In typical observation of EP, to assure that the electron beam can beirradiated on the overall EOV plane of EP1409 as from vertically abovethe wafer surface as possible as shown in FIG. 14C, it is frequent thatthe irradiation position on the wafer surface of an electron beam 1408Blanding in an incident direction vertical to the wafer surface (calledelectron beam vertical incident coordinates) is so set as to besubstantially brought to an FOV center 1408 of the EP. In other words,an electron beam 1410B landing on the edge of FOV of the EP under a tiltangle 1410A making to the vertically incident electron beam 1408B isdeemed as being at the most tilted position among the electron beamirradiation positions inside the EP but this tilt angle can beminimized.

But when the plural EP's are imaged sequentially by merely effecting thesequential movement through beam shift as described previously, it isdifficult to cause the electron beam to be vertically incident on allcenters of FOV of the plural EP's. Therefore, when a common AP shared bya plurality of EP's is set, electron beam vertically incidentcoordinates 1402 must be determined pursuant to some method as shown inFIG. 14B (FIG. 14B is a diagram when FIG. 14A is viewed sidewaysthereof). The present invention features that on conditions that forexample, movement of the EP's to be imaged and the imaging point as wellfrom the electron beam vertically incident coordinates 1402 is possiblethrough beam shift, the incident angle of the electron beam when imagingthe EP's and imaging point is smaller than a permissible electron beamincident angle to be described later and the imaging point can be sharedas many EP's as possible, not only the electron beam vertically incidentcoordinates 1402 but also imaging points such as the EP's by which theAP is shared and the AP are determined. Illustrated in FIG. 14B is anexample where two EP's 1404 and 1405 are imaged by using a common AP1403 and incident angles of the electron beam when imaging centers ofthe individual templates are designated by 1403A, 1404A and 1405A,respectively.

The present invention also features that the permissible electron beamincident angle can be set in respect of the kind of each template and EP(one of values of requested picture quality 517 in FIG. 5). Under thelimit condition at the least, imaging can be permitted within a range1406 of movement from the electron beam vertically incident coordinatesthrough beam shift but with the picture quality and the accuracy ofvarious processes using picked-up images as well in mind, the beamincident angle preferably approximates verticality and so the searchrange of each template can be narrower than the range 1406. Especiallyat the EP, measurement of a highly accurate pattern shape is conductedand therefore, in comparison with the AP, for example, requirements forthe permissible electron beam incident angle are sometimes stringent. InFIG. 14B, inputting of the AP is exemplified so that the AP may beselected from the moving range 1406 based on beams shift and the EP'smay be selected from a separately designated range 1407. The inputdesignation can be fulfilled in the form of either permissible electronbeam incident angle 1407A or the range 1407 spreading from the electronbeam vertically incident coordinates 1402.

3.3 Registry Template

A description will be given of a method for registering a template of anevaluation point or a selected imaging point in the imaging recipe bymaking reference to FIG. 15A.

An instance will be considered in which an arbitrary imaging point 1502is selected in CAD data 1501. As an example for explanation, the imagingpoint 1502 is assumed to be an AP. For registration of the AP 1502 in animaging recipe 1513, the following six methods can be listed up.

-   (1) CAD data (coordinate data) corresponding to the imaging point    1502 cut out of the CAD data 1501 is registered as a registry    template in the imaging recipe 1513.-   (2) Modified CAD data 1505 obtained by adding an arbitrary    modification 1504 (for example, the previously described    modification shown at 1202 in FIG. 12A) to the CAD data (coordinate    data) corresponding to the imaging point 1502 cut out of the CAD    data 1501 is registered as a registry template in the imaging recipe    1513.-   (3) A CAD image 1507 obtained by applying image conversion 1506 (for    example, the previously-described making image indicated in FIG.    12B) to the CAD data corresponding to the imaging point 1502 cut out    of the CAD data 1501 is registered as a registry template in the    imaging recipe 1513.-   (4) A modified CAD image 1509 obtained by applying arbitrary    modification/brightness addition 1508 (for example, the    previously-described modification/brightness addition indicated at    1204 and 1205 in FIG. 12A) to the CAD image 1507 as a result of the    image conversion 1506 (for example, the previously-described image    making in FIG. 12B) applied to the CAD data corresponding to the    imaging point 1502 cut out of the CAD data 1501 is registered as a    registry template in the imaging recipe 1513.-   (5) An SEM image 1510 at the above imaging point acquired by    actually imaging an arbitrary imaging point is registered as a    registry template in the imaging recipe 1513.-   (6) An SEM image 1512 obtained by applying an arbitrary imaging    process to the SEM image 1510 at the aforementioned imaging point as    a result of actual imaging of an arbitrary imaging point is    registered as a registry template in the imaging recipe 1513.    Exemplified as the imaging process is a smoothing process of image,    a noise elimination process or a line segment extraction process.    When the line segment extraction process is executed, the SEM image    1512 is processed to line segment information.

The present invention features that any one of templates of the above(1) to (6) formats is selectively registered in the imaging recipe orarbitrary ones of these templates are registered in combination in theimaging recipe. The presence of a plurality of variations in the formatof a template, for example, an AP template to be registered in theimaging recipe has an advantage that speedup of a matching processbetween a registry template used for addressing an imaging position inthe actual imaging sequence and an actually imaged template can beassured and highly accurate matching can be attained.

In a method of processing matching (1515) between the registry templateand the actually imaged template, various variations can be thought of.In a method, for example, image matching (1518) between imageinformation of a registry template (for example, template 1507, 1509,1510 or 1512, an image as a result of application of an arbitraryprocess 1516 to the template 1507, 1509, 1510 or 1512 or template 1503,1505 or 1512 subjected to making image through the process 1516) andimage information of an actually imaged template (template 1514 ortemplate as a result of application of an arbitrary image process 1517to the template 1514) is executed, whereby a positional shift amount1519 can be calculated and the shift amount can be delivered (1520). Inanother method, line segment matching (1518) between line segmentinformation of a registry template (for example, line segmentinformation extracted from a template 1503, 1505 or 1512, a template asa result of application of the arbitrary process 1516 to the template1503, 1505 or 1512 or a temple 1507, 1509, 1510 or 1512 subjected toline segment extraction through the process 1516) and line segmentinformation of an actually imaged template (line segment informationextracted from the template 1514 through the process 1517) is executed,whereby a positional shift amount 1519 can be calculated and the shiftamount can be delivered (1520).

As described above, the template subject to the arbitrary process 1516(arbitrary imaging process or shape modification, or conversion to anarbitrary data format) is sometimes used in matching and so by saving,in the imaging recipe, a template undergone the arbitrary process 1516in accordance with the matching method, the arbitrary process 1516 neednot be carried out each time the matching process is conducted tothereby speedup the processing. Further, arbitrary ones of the registrytemplates 1503, 1505, 1507, 1509, 1510 and 1512 can be saved incombination in the imaging recipe.

4. System Constitution (Database Management, Sharing)

An embodiment of apparatus constitution in the present invention will bedescribed with reference to FIGS. 16A and 16B.

The apparatus shown in FIG. 16A comprises a mask pattern design unit1601, a mask drawing unit 1602, a mask pattern exposure/developing unit1603, an etching unit 1604, SEM apparatus 1605 and 1607, SEM controlunits 1606 and 1608 for controlling the SEM apparatus 1605 and 1607,respectively, an EDA (electronic design automation) tool bar 1609, adatabase server 1610, a storage 1611 for saving the database, an imageprocess/imaging recipe creation operation unit 1612, an imaging recipeserver 1613 and an evaluation tool server 1614 for evaluating a createdpattern shape (for making a comparison between shapes of, for example,SEM image data and design data of the evaluation pattern). Thecomponents as above can transmit/receive information through a network.

The storage 1611 attached to the database server 1610 can save defaultvalue, setting value and calculation value of arbitrary input/outputinformation shown in FIG. 5 by linking them to the product kind,manufacture date and time and success/failure results of imaging orprocessing and also can consult the saved data. In the figure, as anexample, the two SEM apparatus 1605 and 1607 are connected to thenetwork but in the present invention, the imaging recipe can be sharedby a plurality of arbitrary SEM apparatus by way of the data server 1611or imaging recipe server 1613 and with an imaging recipe once created,the plural SEM apparatus can be operated. When the database is shared bythe plurality of SEM apparatus, the success/failure results of oldimaging or processing can be stored speedily and the stored data can beconsulted to assist in excellent imaging recipe creation.

The embodiment shown in FIG. 16A can be modified as shown in FIG. 16B inwhich the components 1606, 1608, 1609, 1610 and 1612 to 1614 areincorporated in a single unit 1616. As in this modification, it ispossible to process arbitrary functions by distributing them toarbitrary plural units or incorporating them in a single unit.

5. GUI

Reverting to FIG. 11, an embodiment of the GUI for setting input/outputinformation or displaying the results in the present invention will bedescribed. As shown at a window 1701 in FIG. 11, various kinds ofinformation to be described below can be displayed allover the screen ordivisionally by means of a monitor, for example. In FIG. 11, mark *indicates an arbitrary numerical value (or letter string) or a range ofnumerical value, or arrangement of numerical value or numerical valuerange inputted or outputted to or from the system. Setting of inputinformation will be described.

In a window 1718, the information pieces 506 to 519 shown in FIG. 5 areenumerated (indicated as information 1, 2, . . . in the figure) and theenumerated individual information pieces 506 to 519 are designated inbox 1720 as to whether to be used as input information to the imagingrecipe automatic creation engine or not. In the box 1720, informationentered as “IN” indicates input information and information entered as“-” is not handled as input information. To the information designatedas input information, its numerical value or numerical value range orname (for example, kind, process, material) can be designated in box1719.

In a window 1721, the selective factor index values such as complexityand easiness of deformation (for example, 911 to 913 in FIG. 9. Inaddition, a selective factor index value based on other evaluationcriterion may be included) are enumerated and arbitrary selective factorindex values to be evaluated in respect of individual imaging pointkinds (q-th AP, AF, AST and ABCC) designated by a box 1775 can beselected in combination by using a check box 1722 (as an example, threeselective factor index values of “complexity”, “peculiarity” and“distance from EP” are selected in FIG. 11). Further, on the basis ofthe chosen selective factor index values, threshold values Thi (i=1 toNt, Nt≧1. For example, 914 to 916 in FIG. 9) for setting a forbiddenarea and weights Wi (i=1 to Nw, Nw≧1) for calculation of selective indexvalue (for example, 923 to 925 in FIG. 9) can be designated by means ofboxes 1724 and 1725, respectively. Besides, an input data format usedfor calculation of the respective selective factor index values can bechosen from, for example, a pull-down menu 1723. Specifically, it can bedesignated that as the input information for calculation of theselective factor index values, the CAD data is used, the CAD image isused, both the CAD data and the CAD image data are used or none of theCAD data and CAD image is used.

Further, an instance will be possible in which as represented by thedivision of addressing point previously shown in FIG. 7B, a properimaging point cannot be selected with selective process parameters suchas threshold value Thi and weight Wi initially designated in the window1721 (for example, with the parameters supposing addressing by a singleaddressing point) and the selective process parameters are required tobe changed (for example, to parameters supposing addressing by twoaddressing points). Accordingly, depending on conditions, the user candesignate a plurality of selective process parameters or such aninstance as above can be determined automatically inside the system andthe selective process parameters can be changed automatically.

By ON/OFF checking a check box 1726, a choice can be made as to whetheran imaging point is shared by a plurality of EP's as explained inconnection with FIG. 7D or as to whether the optimization process ofimaging template selection is executed by taking the positional relationamong plural different EP's into account as typified by setting of aforbidden area in consideration of plural EP's explained in connectionwith FIG. 13B can be selected.

By ON/OFF checking a check box 1727, a choice can be made as to whetherthe process of switching the imaging point or imaging sequence isexecuted by considering the relief function explained in connection withFIGS. 7F and 7G. Namely, with the check box 1727 checked ON, thesuccess/failure of the process at each imaging point is decided and inthe case of a failure of the process, causes of the failure are presumedso that a candidate for the imaging point or imaging sequence necessaryfor switching the imaging point or imaging sequence may be determined inaccordance with the failure causes.

A box 1728 can designates the number of candidates when determining theplural imaging sequence candidates in advance for the sake of relieffunction. In a window 1733, items 1742 concerning the individualevaluation points EP[p] (p=1 to Np, Np≧1) are designated (in the figure,EP[1] is indicated but the items can be settable for EP[p] correspondingto an arbitrary arrangement number p). Designated as the items arecoordinates (x, y) of each evaluation point EP[p](p=1 to Np, Np≧1), thesize/shape of imaging point, the moving method (beam shift or stageshift) and the imaging condition. These items may be designated inarbitrary combination. Then, in a window 1759, the data format of aregistry template for EP[p] to be registered in the imaging recipe canbe designated.

The data format is represented by the CAD data, modified CAD data, CADimage, modified CAD image, SEM image and modified SEM image andarbitrary ones may selectively be combined so as to be registered as atemplate or conversely, no template can be registered (outputted).Electron beam vertically incident coordinates can be inputted to oroutputted from a box 1776. For example, in case the imaging sequence isoptimized with a single EP, the electron beam vertically incidentcoordinates can be so designated as to be identical to the centercoordinate of the EP or in case the imaging sequence inclusive of animaging point shared by plural EP's is optimized, the electron beamvertically incident coordinates can be optimized inside the imagingrecipe automatic creation engine and then outputted to the box 1776.

Next, in an area 1774, information designative as input information isset in respect of an arbitrary imaging point (imaging points AP[p][q],AF[p][q], AST[p][q] and ABCC[p][q] subject to a q-th processing inobservation of a p-th evaluation point). In the figure, as an example ofimaging points, AP[1][1], AF[1][1], AST[1][1], ABCC[1][1], AP[1][2],AF[1][2], AST[1][2] and ABCC[1][2] are displayed in order of 1734 to1741 but the method for designation of the input information is the samefor these imaging points and so the AP[1][1]1734 will particularly betaken and described hereunder.

As illustrated, in the items 1734, the presence or absence of imagingpoint setting (in the case of absence, AP[1][1] is not set), imagingorder of imaging point, coordinates (x, y) of imaging point, size/shapeof imaging point (area), moving method (beam shift or stage shift) andimaging condition are included and arbitrary ones can be designated incombination. For information whose value is designated, the value(inclusive of a letter string) is entered in a corresponding item 1743on the right and “IN (ID of input information)” is entered in a box1751. Here, a range of values can be entered in item 1743 and a propervalue within the range can be outputted by means of the imaging recipeautomatic creation engine. For example, a process can be conceivable inwhich the size of AP[1][1] is so designated as to be set within a rangeof 3 to 10 μm and the engine outputs a size of 5 μm as a proper value.In this case, the value range is entered in the item 1743 and “IN-OUT(ID of input and output information) is entered in the box 1751.Further, like the aforementioned window 1759 of EP[p], the data formatof a registry template for AP[1][1] to be registered in the imagingrecipe can be designated in a window 1760.

Next, a description will be given of setting of output information. Forthe output information, “OUT(ID of output information)” is entered incorresponding one of the boxes 1751 to 1758. Information used as neitherinput information nor output information is designated by entering “-(IDof unused information)” in corresponding one of the boxes 1751 to 1758.

When a button 1729 is depressed, the imaging recipe automatic creationengine calculates output information on the basis of a combination ofinput/output information pieces designated in the manner describedpreviously to indicate the output information to the items 1743 to 1750in association with the respective boxes 1751 to 1758 on which “OUT” or“IN-OUT” is entered.

In the FIG. 11 example, in accordance with the user command or thedefault value, necessity is set for AP[1][1], AF[1][1] and AF[1][2] andneedlessness is set for AST[1][1] and ABCC[1][1] whereas the imagingrecipe automatic creation engine is so designated as to be caused tooutput the presence/absence of setting for AP[1][2], AST[1][2]andABCC[1][2] so that the results of output of the imaging recipe automaticengine may indicate that necessity is set for the AP[1][2] and AST[1][2]and needlessness is set for the ABCC[1][2]. Further, the outputstipulates the imaging sequence (order of imaging the imaging points)such that AP[l] [l]→AF[l] [l]→AP[1] [2]AST[1] [2]AF[1] [2]→AP[1][2]EP[1] stands. Further, the evaluation value or preferential order ofthe imaging sequence can be indicated in a box 1771. The evaluationvalue quantitatively determines the degree of success of imaging theEP[1] pursuant to the imaging sequence and can be calculated on thebasis of, for example, a selective index value (929 in FIG. 9) at theimaging point involved in the imaging sequence.

A plurality of candidates for imaging sequence can be calculated and inthe figure, Ns imaging sequence candidates 1768 to 1770 are delivered(no results are shown after 1769 but for example, by clicking acorresponding tag, an indication can be obtained like 1768). An imagingpoint at an r-th imaging sequence can be indicated by, for example,AP[p][q][r] (in the figure, 3^(rd) parameter inscription is omitted).The above description is given particularly by way of the EP[1] but asimilar process can be applied to each evaluation point EP[p](p=1 toNp).

By turning ON the box 1726, the order of imaging the EP[p] (p=1 to Np)can be optimized and delivered to a box 1732 in a window 1731. In theexample shown in the figure, the output is so stipulated as to performimaging in an order of EP[2]→EP[1]→EP[3]. In this manner, as typified bysharing of an imaging point by plural EP's explained using FIG. 7D, thereduction of the number of imaging operations (the number of imagingpoints) and the shortening of the view field moving distance can beassured through the sharing and optimization of imaging order of EP[p],thus realizing high throughput throughout the observation of all of theplural EP[p]'s.

A designated or outputted imaging point can be confirmed in a window1702. By setting ON/OFF of check box group 1713 in the window 1702,design data, various imaging points, selective factor index values ordistribution thereof, beam shift movable range and forbidden area can beindicated in arbitrary combination. In the figure, coordinates andsize/shape of respective imaging points are indicated at 1705 to 1710.In connection with the respective imaging points, the selective factorindex value or selective index value or preferential order value can beindicated together with the indications 1705 to 1710.

In a display 1711 of CAD data, through layer selection in a window 1714,an arbitrary combination of layers can be displayed in a overlappingfashion. Gauges 1703 and 1704 describing dimensions around the display1711 of CAD data can be displayed. By designation through a radio button1715, relative coordinates from the EP or absolute coordinates on thechip can be indicated at the gauges 1703 and 1704. Also, the displaymagnification and the display position center in 1702 can be designatedin boxes 1716 and 1717, respectively. The center of display position canbe designated by p representing ID of EP[p] (so that the designatedEP[p] may be brought to the center of the screen and displayed thereat)or by coordinate value (x, y). Further, in place of the display 1711 ofCAD data, an actually imaged SEM image can otherwise be displayed.

With a button 1730 depressed, information of inputted or outputtedimaging point or imaging sequence and a registry template can bedelivered to the imaging recipe. In this case, plural imaging pointcandidates or plural imaging sequence candidates can be delivered to asingle imaging recipe or can be divided so as to be delivered to aplurality of imaging recipes.

The imaging recipe automatic creation method, the imaging pointevaluation method or display method (GUI) or the file management methodand system constitution according to the present invention set forth sofar can be utilized in not only the SEM but also the optical microscopeor scanning probe microscope (SPM). In other words, even in the opticalmicroscope or SPM, AP, AF and EP are sometimes required to be set andthis requirement can be dealt with by changing the evaluation criterionof selective factor index value described in the present invention. Theoptical microscope can also be utilized for automatic search of globalalignment mark from CAD data in the step 302 in FIG. 3. In the SPM, theSEM image described so far corresponds to depth information acquiredwith the SPM or conversion of the depth information into an image (thevalue of depth is converted into a brightness value of the image).

The invention may be embodied in other specific forms without departingfrom the spirit or essential characteristics thereof. The presentembodiment is therefore to be considered in all respects as illustrativeand not restrictive, the scope of the invention being indicated by theappended claims rather than by the foregoing description and all changeswhich come within the meaning and range of equivalency of the claims aretherefore intended to be embraced therein.

1. A method of imaging a specimen by using a scanning electronmicroscope, comprising the steps of: inputting coordinates of anevaluation point on the specimen on which patterns are formed;acquiring, from CAD data, design layout information of a pattern formedin an area containing said evaluation point on said specimen; selecting,as input information, part or all of imaging parameters such asprocessing parameter, user request specifications, history information,the number, coordinates, size, shape and imaging sequence of imagingpoints each for addressing, auto-focus or auto-brightness/contrast,electron beam vertically incident coordinates and imaging conditions;selecting, as output information, part or all of imaging parameters suchas the number, coordinates, size, shape and imaging sequence of imagingpoints each for addressing, auto-focus or auto-brightness/contrast,electron beam vertically incident coordinates, imaging conditions andevaluation value or preferential order of the imaging point or imagingsequence; calculating the selected output information by using the valueor range of the inputted coordinate information of the evaluation point,the acquired design layout information and the value or range of saidselected input information; storing both the imaging parameters of saidinput information and output information; storing the pattern at saidevaluation point or patterns at imaging points as registry templates;and sequentially imaging patterns formed on said specimen on the basisof said stored imaging parameters and registry templates.
 2. A specimenimaging method using a scanning electron microscope according to claim1, wherein at least one of addressing point, auto-focus point,auto-stigmatism point and auto-brightness/contrast point and theevaluation point as well are involved in said imaging order.
 3. Aspecimen imaging method using a scanning electron microscope accordingto claim 1, wherein in the step of inputting coordinates of anevaluation point on the specimen, coordinates of a plurality ofevaluation points are inputted and in the step of calculating theimaging parameter, part or all of imaging points for addressing,auto-focus, auto-stigmatism or auto-brightness/contrast are shared bysaid plurality of evaluation points.
 4. A specimen imaging method usinga scanning electron microscope according to claim 1, wherein in the stepof calculating the output information, imaging areas associated withplural arbitrary evaluation points and nearby neighboring areas thereof,an area outside a beam shift movable range or an area where a selectivefactor index value does not reach a stipulated threshold value is set asa forbidden area for selection of the addressing point, auto-focuspoint, auto-stigmatism point or auto-brightness/contrast point.
 5. Aspecimen imaging method using a scanning electron microscope accordingto claim 1, wherein in the step of calculating the output information,at the time of evaluating an arbitrary imaging point, an evaluation ismade of a pattern which is contained in an area which is made bytrimming the imaging size area from its boundary line in an estimativevalue of imaging position shift amount.
 6. A specimen imaging methodusing a scanning electron microscope according to claim 1, wherein inthe step of storing a pattern at said imaging point as a registrytemplate, design layout information at said evaluation point or imagingpoint, image information of imaged design layout information, modifieddesign layout information obtained by applying an arbitrary process tosaid design layout information, modified image information obtained byapplying an arbitrary process to said image information, an SEM imageactually picked up at said evaluation point or imaging point and amodified SEM image obtained by applying an arbitrary process to said SEMimage are stored in arbitrary combination as said registry template. 7.A method of imaging a specimen by using a scanning electron microscope,comprising the steps of: inputting coordinates of an evaluation point onthe specimen on which patterns are formed; acquiring, from CAD data,design layout information of a pattern formed in an area containing saidevaluation point on said specimen; creating image data corresponding tosaid acquired design layout information; calculating a plurality ofselective factor indexes by selectively using the acquired design layoutinformation and the created image data in respect of the individualselective factor indexes; calculating a total selective indexconstituted by using said plural selective factor indexes incombination; and calculating the output information for imaging saidevaluation point on the basis of said total selective index.
 8. Aspecimen imaging method using a scanning electron microscope accordingto claim 7, wherein in the step of calculating the imaging parameter,for the sake of imaging said evaluation point, a plurality of candidatesfor a set of part or all of the parameters such as the number,coordinates, size, shape and imaging order of the imaging points eachfor addressing, auto-focus, auto-stigmatism or auto-brightness/contrast,electron beam vertically incident coordinates, imaging conditions andthe evaluation value or preferential order of the imaging conditions arecalculated.
 9. A specimen imaging method using a scanning electronmicroscope according to claim 7, wherein in the step of sequentiallyimaging patterns formed on said specimen, imaging of a pattern to bepicked up is decided as to whether to be successful or unsuccessful andif imaging or process is unsuccessful, the imaging point or imagingsequence is changed and then imaging is again carried out.
 10. Aspecimen imaging method using a scanning electron microscope accordingto claim 9, wherein when imaging is again carried out after changing theimaging point or imaging sequence, causes of a failure in imaging orprocessing are sorted and on the basis of a cause of failure, theimaging point or imaging order is changed.
 11. A scanning electronmicroscope comprising: input means for inputting coordinate informationof an evaluation point on a specimen having its surface formed withpatterns; layout information acquisition means for acquiring, from CADdata, design layout information of a pattern formed in an areacontaining said evaluation point on the specimen on the basis of saidcoordinate information inputted from said input means; means forselecting, as input information, part or all of imaging parameters suchas processing parameter, user request specifications, historyinformation, the number, coordinates, size, shape and imaging sequenceof imaging points each for addressing, auto-focus orauto-brightness/contrast, electron beam vertically incident coordinatesand imaging conditions; means for selecting, as output information, partor all of imaging parameters such as the number, coordinates, size,shape and imaging sequence of imaging points each for addressing,auto-focus or auto-brightness/contrast, electron beam verticallyincident coordinates, imaging conditions and the evaluation value orpreferential order of the imaging point or imaging sequence; means forcalculating said selected output information by suing the coordinateinformation of the evaluation point inputted from said input means, thedesign layout information acquired by said layout informationacquisition means and the value or range of said selected inputinformation; memory means for storing the imaging parameters of bothsaid input information and output information; means for storing thepattern at said evaluation point or patterns at imaging point asregistry templates; and imaging means for acquiring an SEM image of saidspecimen by sequentially imaging patterns formed on said specimen on thebasis of the imaging parameters and registry template stored in saidmemory means.
 12. A scanning electron microscope according to claim 11,wherein at least one of the addressing point, auto-focus point,auto-stigmatism point and auto-brightness/contrast point and theevaluation point are involved in said imaging sequence.
 13. A scanningelectron microscope according to claim 11, wherein said means forcalculating the output information includes a unit for evaluating, atthe time of evaluating an arbitrary imaging point, a pattern which iscontained in an area nearby the imaging size of said imaging point andcorresponding to an estimative value of imaging position shift amount.14. A scanning electron microscope according to claim 11, wherein insaid means for storing a pattern at said evaluation point or patterns atimaging points as registry templates, design layout information at saidevaluation point or imaging points, image information of imaged designlayout information, modified design layout information obtained byapplying an arbitrary process to said design layout information,modified image information obtained by applying an arbitrary process tosaid image information, an SEM image actually imaged at said evaluationpoint or imaging point and a modified SEM image obtained by applying anarbitrary process to said SEM image are stored in arbitrary combinationas said registry template.
 15. A scanning electron microscopecomprising: input means for inputting coordinates of an evaluation pointon a specimen having its surface formed with patterns; layoutinformation acquisition means for acquiring, from CAD data, designlayout information of a pattern formed in an area containing saidevaluation point on said specimen on the basis of said coordinateinformation inputted from said input means; CAD image creation means forcreating image data corresponding to said design layout informationacquired by said layout information acquisition means; means forcalculating a plurality of selective factor indexes by selectively usingthe design layout information acquired by said layout informationacquisition means and the image data created by said image creationmeans in respect of the individual selective factor indexes; means forcalculating a total selective index constituted by using said pluralselective factor indexes in combination; and means for calculating theoutput information for imaging said evaluation point on the basis ofsaid total selective index.
 16. A scanning electron microscope accordingto claim 15, wherein said means for calculating the imaging parametercalculates, for the sake of imaging said evaluation point, a pluralityof candidates for a set of part or all of the parameters such as thenumber, coordinates, size, shape and imaging order of imaging pointseach for addressing, auto-focus, auto-stigmatism orauto-brightness/contrast, electron beam vertically incident coordinates,imaging conditions and the evaluation value or preferential order of theimaging condition are calculated.
 17. A scanning electron microscopeaccording to claim 15, wherein said image processing means decidesimaging of a pattern to be imaged as to whether to be successful orunsuccessful and if imaging or process is unsuccessful, changes theimaging point or imaging sequence and again performs imaging.
 18. Ascanning electron microscope comprising; input means for inputtingcoordinate information of an evaluation point on a specimen having itssurface formed with patterns; display means for displaying CAD datacorresponding to the coordinate information inputted from said inputmeans; pattern selection means for selecting a plurality of patterns tobe imaged for the sake of acquiring the image necessary for evaluatingsaid evaluation point inputted from said input means; means forselecting, as input information, part or all of imaging parameters suchas processing parameter, user request specifications, historyinformation, the number, coordinates, size, shape and imaging order ofimaging points each for addressing, auto-focus orauto-brightness/contrast, electron beam vertically incident coordinatesand imaging conditions; means for inputting the value or range to theinput information selected by said selection means; display means fordisplaying said input information; means for selecting, as outputinformation, part or all of imaging parameters such as the number,coordinates, size, shape and imaging order of imaging points each foraddressing, auto-focus or auto-brightness/contrast which are calculatedfor the sake of imaging the plural patterns selected by said evaluationpatterns selection means, electron beam vertically incident coordinates,imaging conditions and evaluation value or preferential order of theimaging point or imaging sequence; display means for displaying resultsof calculation of the selected output information; imaging means forsequentially imaging patterns formed on the specimen on the basis of theimaging parameters determined by said imaging sequence determining meansto acquire an SEM image of said specimen; and image processing means forprocessing the image picked up by said imaging means.
 19. A scanningelectron microscope according to claim 18, wherein the pattern selectedby said pattern selection means is displayed while being superimposed onthe CAD data displayed on said display means.